Semiconductor wafer handling and transport

ABSTRACT

A substrate processing system including at least two vertically stacked transport chambers, each of the vertically stacked transport chambers including a plurality of openings arranged to form vertical stacks of openings configured for coupling to vertically stacked process modules, at least one of the vertically stacked transport chambers includes at least one transport chamber module arranged for coupling to another transport chamber module to form a linear transport chamber and another of the at least two stacked transport chambers including at least one transport chamber module arranged for coupling to another transport chamber module to form another linear transport chamber, and a transport robot disposed in each of the transport chamber modules, where a joint of the transport robot is locationally fixed along a linear path formed by the respective linear transport chamber.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is the National Stage of International Application No.PCT/IB2012/002688 having International Filing date, 26 Oct. 2012, whichdesignated the United States of America, and which InternationalApplication was published under PCT Article 21 (s) as WO Publication2013/072760 A2 and which claims priority from, and benefit of U.S.provisional patent application No. 61/551,779 filed on 26 Oct. 2011, thedisclosures of which are incorporated by reference herein in theirentireties.

BACKGROUND

1. Field

The aspects of the disclosed embodiment relate to semiconductorprocessing systems, and specifically relates to vacuum semiconductorprocessing work piece handling and transportation.

2. Brief Description of Related Developments

Current semiconductor manufacturing equipment takes several differentforms, each of which has significant drawbacks. Cluster tools, machinesthat arrange a group of semiconductor processing modules in a radiusabout a central robotic arm, take up a large amount of space, arerelatively slow, and, by virtue of their architecture, are limited to asmall number of semiconductor process modules, typically a maximum ofabout five or six. Linear tools, while offering much greater flexibilityand the potential for greater speed than cluster tools, do not fit wellwith the current infrastructure of most current semiconductorfabrication facilities. Moreover, linear motion of equipment componentswithin the typical vacuum environment of semiconductor manufacturingleads to problems in current linear systems, such as unacceptable levelsof particles that are generated by friction among components. Severalhybrid architectures exist that use a combination of a radial processmodule arrangement and a linear arrangement.

As semiconductor manufacturing has grown in complexity, it becomesincreasingly necessary to transfer wafers among a number of differentprocess modules or clusters of process modules, and sometimes betweentools and modules that are separated by significant distances. Thisposes numerous difficulties, particularly when wafers are transferredbetween separate vacuum processing facilities. Transfers between vacuumenvironments, or between a vacuum and other processing environmentsoften results in increased risk of particle contamination (due to thepumping and venting of wafers in load locks) as well as higher thermalbudgets where wafers are either heated or cooled during transfers.

There remains a need for improved wafer transport and handling systemfor use in semiconductor manufacturing environments.

SUMMARY

Provided herein are methods and systems used for improved semiconductormanufacturing handling, and transport. Modular wafer transport andhandling facilities are combined in a variety of ways deliver greaterlevels of flexibility, utility, efficiency, and functionality in avacuum semiconductor processing system. Various processing and othermodules may be interconnected with tunnel-and-cart transportationsystems to extend the distance and versatility of the vacuumenvironment. Other improvements such as bypass thermal adjusters,buffering aligners, batch processing, multifunction modules, lowparticle vents, cluster processing cells, and the like are incorporatedto expand functionality and improve processing efficiency.

As used herein, “robot” shall include any kind of known robot or similardevice or facility that includes a mechanical capability and a controlcapability, which may include a combination of a controller, processor,computer, or similar facility, a set of motors or similar facilities,one or more resolvers, encoders or similar facilities, one or moremechanical or operational facilities, such as arms, wheels, legs, links,claws, extenders, grips, nozzles, sprayers, end effectors, actuators,and the like, as well as any combination of any of the above. Oneembodiment is a robotic arm.

As used herein “drive” shall include any form of drive mechanism orfacility for inducing motion. In embodiments it includes themotor/encoder section of a robot.

As used herein, “axis” shall include a motor or drive connectedmechanically through linkages, belts or similar facilities, to amechanical member, such as an arm member. An “N-axis drive” shallinclude a drive containing N axes; for example a “2-axis drive” is adrive containing two axes.

As used herein, “arm” shall include a passive or active (meaning.containing motors/encoders) linkage that may include one or more arm orleg members, bearings, and one or more end effectors for holding orgripping material to be handled.

As used herein, “SCARA arm” shall mean a Selectively Compliant AssemblyRobot Arm (SCARA) robotic arm in one or more forms known to those ofskill in the art, including an arm consisting of one or more upper linksconnected to a drive, one or more lower links connected through a beltor mechanism to a motor that is part of the drive, and one or more endunits, such as an end effector or actuator.

As used herein, “turn radius” shall mean the radius that an arm fits inwhen it is fully retracted.

As used herein, “reach” shall include, with respect to a robotic arm,the maximum reach that is obtained when an arm is fully extended.Usually the mechanical limit is a little further out than the actualeffective reach, because it is easier to control an arm that is notcompletely fully extended (in embodiments there is a left/rightsingularity at full extension that can be hard to control).

As used herein, “containment” shall mean situations when the arm isoptimally retracted such that an imaginary circle can be drawn aroundthe arm/end effector/material that is of minimum radius.

As used herein, the “reach-to-containment ratio” shall mean, withrespect to a robotic arm, the ratio of maximum reach to minimumcontainment.

As used herein, “robot-to-robot” distance shall include the horizontaldistance between the mechanical central axis of rotation of twodifferent robot drives.

As used herein, “slot valve” shall include a rectangular shaped valvethat opens and closes to allow a robot arm to pass through (as opposedto a vacuum (isolation) valve, which controls the pump down of a vacuumchamber). For example, the SEMI E21.1-1296 standard (a publishedstandard for semiconductor manufacturing) the slot valve for 300 mmwafers in certain semiconductor manufacturing process modules has anopening width of 336 mm, an opening height of 50 mm and a total valvethickness of 60 mm with the standard also specifying the mounting boltsand alignment pins.

As used herein, “transfer plane” shall include the plane (elevation) atwhich material is passed from a robot chamber to a process modulechamber through a slot valve. Per the SEMI E21.1-1296 standard forsemiconductor manufacturing equipment the transfer plane is 14 mm abovethe slot valve centerline and 1100 mm above the plane of the factoryfloor.

As used herein, “section” shall include a vacuum chamber that has one ormore robotic drives in it. This is the smallest repeatable element in alinear system.

As used herein, “link” shall include a mechanical member of a robot arm,connected on both ends to another link, an end effector, or the robotdrive.

As used herein, “L1”, “L2”, “L3” or the like shall include the numberingof the arm links starting from the drive to the end effector.

As used herein, “end effector” shall include an element at an active endof a robotic arm distal from the robotic drive and proximal to an itemon which the robotic arm will act. The end effector may be a hand of therobot that passively or actively holds the material to be transported ina semiconductor process or some other actuator disposed on the end ofthe robotic arm.

As used herein, the term “SCARA arm” refers to a robotic arm thatincludes one or more links and may include an end effector, where thearm, under control, can move linearly, such as to engage an object. ASCARA arm may have various numbers of links, such as 3, 4, or more. Asused herein, “3-link SCARA arm” shall include a SCARA robotic arm thathas three members: link one (L1), link two (L2) and an end effector. Adrive for a 3-link SCARA arm usually has 3 motors: one connected to L1,one to the belt system, which in turn connects to the end effectorthrough pulleys and a Z (lift) motor. One can connect a fourth motor tothe end effector, which allows for some unusual moves not possible withonly three motors.

As used herein, “dual SCARA arm” shall include a combination of twoSCARA arms (such as two 3 or 4-link SCARA arms (typically designated Aand B)) optionally connected to a common drive. In embodiments the twoSCARA arms are either completely independent or share a common linkmember L1. A drive for a dual independent SCARA arm usually has eitherfive motors: one connected to L1-A, one connected to L1-B, one connectedto the belt system of arm A, one connected to the belt system of arm B,and a common Z (lift) motor. A drive for a dual dependent SCARA armusually has a common share L1 link for both arms A and B and containstypically four motors: one connected to the common link L1, oneconnected to the belt system for arm A, one connected to the belt systemfor arm B, and a common Z (lift) motor.

As used herein, “4-link SCARA arm” shall include an arm that has fourmembers: L1, L2, L3 and an end effector. A drive for a 4-link SCARA armcan have four motors: one connected to L1, one to the belt systemsconnected to L2 and L3, one to the end effector and a Z motor. Inembodiments only 3 motors are needed: one connected to L1, one connectedto the belt system that connects to L2, L3 and the end effector, and a Zmotor.

As used herein, “Frog-leg style arm” shall include an arm that has fivemembers: L1A, L1B, L2A, L3B and an end effector. A drive for a frog-legarm can have three motors, one connected to L1A—which is mechanically bymeans of gearing or the like connected to L1B—, one connected to aturret that rotates the entire arm assembly, and a Z motor. Inembodiments the drive contains three motors, one connected to L1A, oneconnected to L1B and a Z motor and achieves the desired motion throughcoordination between the motors.

As used herein, “Dual Frog-leg style arm” shall include an arm that haseight members L1A, L1B, L2A-1, L2A-2, L2B-1, L2B-2 and two endeffectors. The second link members L2A-1 and L2B-1 form a singleFrog-leg style arm, whereas the second link members L2A-2 and L2B-2 alsoform a single Frog-leg style arm, however facing in an oppositedirection. A drive for a dual frog arm may be the same as for a singlefrog arm.

As used herein, “Leap Frog-leg style arm” shall include an arm that haseight members L1A, L1B, L2A-1, L2A-2, L2B-1, L2B-2 and two endeffectors. The first link members L1A and L1B are each connected to oneof the motors substantially by their centers, rather than by theirdistal ends. The second link members L2A-1 and L2B-1 form a singleFrog-leg style arm, whereas the second link members L2A-2 and L2B-2 alsoform a single Frog-leg style arm, however facing in the same direction.A drive for a dual frog arm may be the same as for a single frog arm.

Disclosed herein are methods and systems for combining a linkable,flexible robotic system with a vacuum tunnel system using moveable cartsfor carrying one or more wafers in vacuum between process modules. Thevacuum tunnel cart may be employed to transfer wafers between processmodules or clusters, while a linkable robotic system is employed withineach module or cluster for local wafer handling. The carts may employany transportation medium suitable for a vacuum environment, such asmagnetic levitation/propulsion.

Disclosed herein are also various configurations of vacuum transportsystems in which heterogeneous handling systems are combined in amodular fashion to allow for more diverse functionality within a singleprocess environment. In general, robots may be provided for waferhandling inside and between process modules that are in proximity toeach other, while allowing for rapid, convenient transport of wafersbetween process cells that are relatively distant. Such heterogeneoushandling systems may include, for example, systems in which roboticarms, such as SCARA arms, are used to handle wafers within processmodules or clusters, while carts or similar facilities are used totransport wafers between process modules or clusters. A cart or similarfacility may include a levitated cart, a cart on a rail, a tube system,or any of a wide variety of cart or railway systems, including variousembodiments disclosed herein.

The methods and systems disclosed herein also include variousconfigurations of robot handling systems in combination with cartsystems, including ones in which cart systems form “U” and “T” shapes,circuits, lines, dual linear configurations (including side-by-side andabove and below configurations) and the like.

Disclosed herein are methods and systems for supporting vacuumprocessing and handling modules in vacuum semiconductor processingsystems. The pedestal support systems herein disclosed may preciselyposition vacuum modules to facilitate proper vacuum sealing betweenadjacent modules. In embodiments, the pedestal's cylindrical shapeaffords opportunity for convenient manufacturing methods while providingstability to the supported vacuum module with a small footprint.

In embodiments, the pedestal support system further may incorporate arobot motor mechanism for a robot operating within the vacuum module,further reducing the overall size and cost of the vacuum processingsystem.

A pedestal support system with a rolling base may also provide neededflexibility in reconfiguring processing and handling modules quickly andcost effectively.

These and other systems, methods, objects, features, and advantages ofthe presently disclosed embodiment will be apparent to those skilled inthe art from the following detailed description of the preferredembodiment and the drawings. All documents mentioned herein are herebyincorporated in their entirety by reference.

BRIEF DESCRIPTION OF THE FIGURES

The foregoing and other objects and advantages of the aspects of thedisclosed embodiment will be appreciated more fully from the followingfurther description thereof, with reference to the accompanyingdrawings, wherein:

FIG. 1 shows equipment architectures for a variety of manufacturingequipment types.

FIG. 2 shows a conventional, cluster-type architecture for handlingitems in a semiconductor manufacturing process.

FIGS. 3A and 3B show a series of cluster-type systems for accommodatingbetween two and six process modules.

FIG. 4 shows high-level components of a linear processing architecturefor handling items in a manufacturing process.

FIG. 5 shows a top view of a linear processing system, such as one withan architecture similar to that of FIG. 4.

FIGS. 6A and 6B show a 3-link SCARA arm and a 4-link SCARA arm.

FIG. 7 shows reach and containment characteristics of a SCARA arm.

FIG. 8 shows high-level components for a robot system.

FIG. 9 shows components of a dual-arm architecture for a robotic armsystem for use in a handling system.

FIG. 10 shows reach and containment capabilities of a 4-link SCARA arm.

FIGS. 11A and 11B show interface characteristics of a 4-link SCARA arm.

FIG. 12 shows a side view of a dual-arm set of 4-link SCARA arms usingbelts as the transmission mechanism.

FIGS. 13A, 13B, and 13C show a dual-arm set of 4-link SCARA arms using aspline link as the transmission mechanism.

FIG. 14 shows an external return system for a handling system having alinear architecture.

FIG. 14 a shows a U-shaped configuration for a linear handling system.

FIG. 15 shows certain details of an external return system for ahandling system of FIG. 14.

FIG. 16 shows additional details of an external return system for ahandling system of FIG. 14.

FIG. 17 shows movement of the output carrier in the return system ofFIG. 14.

FIG. 18 shows handling of an empty carrier in the return system of FIG.14.

FIG. 19 shows movement of the empty carrier in the return system of FIG.14 into a load lock position.

FIG. 20 shows the empty carrier lowered and evacuated and movement ofthe gripper in the return system of FIG. 14.

FIG. 21 shows an empty carrier receiving material as a full carrier isbeing emptied in the return system of FIG. 14.

FIG. 22 shows an empty carrier brought to a holding position, starting anew return cycle in the return system of FIG. 14.

FIG. 23 shows an architecture for a handling facility for amanufacturing process, with a dual-arm robotic arm system and a returnsystem in a linear architecture.

FIG. 24 shows an alternative embodiment of an overall systemarchitecture for a handling method and system of the disclosedembodiment.

FIGS. 25A and 25B show a comparison of the footprint of a linear systemas compared to a conventional cluster system.

FIG. 26 shows a linear architecture deployed with oversized processmodules in a handling system in accordance with aspects of the disclosedembodiment.

FIG. 27 shows a rear-exit architecture for a handling system inaccordance with aspects of the disclosed embodiment.

FIGS. 28A and 28B show a variety of layout possibilities for afabrication facility employing linear handling systems in accordancewith various aspects of the disclosed embodiment.

FIG. 29 shows an aspect of the disclosed embodiment wherein a robot mayinclude multiple drives and/or multiple controllers.

FIG. 30 shows transfer plane and slot valve characteristics relevant toaspects of the disclosed embodiment.

FIG. 31 shows a tumble gripper for centering wafers.

FIG. 32 shows a passive sliding ramp for centering wafers.

FIG. 33 illustrates a fabrication facility including a mid-entryfacility.

FIGS. 34A, 34B and 34C illustrate a fabrication facility including amid-entry facility from a top view.

FIG. 35 illustrates a fabrication facility including the placement ofoptical sensors for detection of robotic arm position and materials inaccordance with aspects of the disclosed embodiment.

FIGS. 36A, 36B and 36C illustrate a fabrication facility in a cross,sectional side view showing optical beam paths and alternatives beampaths.

FIGS. 37A and 37B illustrate how optical sensors can be used todetermine the center of the material handled by a robotic arm.

FIG. 38 shows a conventional 3-axis robotic vacuum drive architecture.

FIG. 39 shows a 3-axis robotic vacuum drive architecture in accordancewith aspects of the disclosed embodiment.

FIG. 40A illustrates a vertically arranged load lock assembly inaccordance with aspects of the disclosed embodiment.

FIG. 40B illustrates a vertically arranged load lock assembly at bothsides of a wafer fabrication facility in accordance with aspects of thedisclosed embodiment.

FIG. 41 shows a vertically arranged load lock and vertically stackedprocess modules in accordance with aspects of the disclosed embodiment.

FIG. 42 shows a linearly arranged, two-level handling architecture withvertically stacked process modules in a cross-sectional side view inaccordance with aspects of the disclosed embodiment.

FIG. 43 shows the handling layout of FIG. 42 in a top view.

FIG. 44 shows an instrumented object on a robotic mm with sensors todetect proximity of the object to a target, in accordance with aspectsof the disclosed embodiment.

FIG. 45 illustrates how the movement of sensors over a target can allowthe robotic arm to detect its position relative to the obstacle.

FIG. 46 shows how an instrumented object can use radio frequencycommunications in a vacuum environment to communicate position to acentral controller.

FIG. 47 illustrates the output of a series of sensors as a function ofposition.

FIG. 48 illustrates how heating elements can be placed in a load lockfor thermal treatment of objects in accordance with aspects of thedisclosed embodiment.

FIGS. 49A and 49B show an end effector tapered in two dimensions, whichreduces active vibration modes in the end effector.

FIGS. 50A and 50B show how vertical tapering of robotic arm elements fora robot planar arm can be used to reduce vibration in the arm set,without significantly affecting vertical stacking height.

FIGS. 51A and 51B illustrate a dual independent SCARA robotic arm.

FIGS. 52A and 52B illustrate a dual dependent SCARA robotic arm.

FIGS. 53A and 53B illustrate a frog-leg style robotic arm.

FIGS. 54A and 54B illustrate a dual Frog-leg style robotic arm.

FIG. 55A illustrates a 4-Link SCARA arm mounted on a moveable cart, aswell as a 4-Link SCARA arm mounted on an inverted moveable cart.

FIG. 55B illustrates a top view of FIG. 55A.

FIG. 56 illustrates using a 3-Link single or dual SCARA arm roboticsystem to pass wafers along a substantially a linear axis.

FIG. 57 illustrates a 2-level vacuum handling robotic system where thetop and bottom process modules are accessible by means of a verticalaxis in the robotic arms.

FIG. 58A shows a two level processing facility where substrates arepassed along a substantially linear axis on one of the two levels.

FIG. 58B illustrates a variation of FIG. 58 a where substrates areremoved from the rear of the system.

FIG. 59A shows a manufacturing facility which accommodates very largeprocessing modules in a substantially linear axis. Service space is madeavailable to allow for access to the interior of the process modules.

FIG. 59B illustrates a more compact layout for 4 large process modulesand one small process module.

FIGS. 60A and 60B illustrate a dual Frog-Leg style robotic manipulatorwith substrates on the same side of the system.

FIG. 61 is a plan view of a preferred embodiment wherein a vacuum tunnelcart is configured with a process module through a transfer robot.

FIG. 62 is a plan view of a preferred embodiment wherein a vacuum tunnelcart is configured with a plurality of process modules through aplurality of transfer robots.

FIG. 63 shows the embodiment of FIG. 62 further including processmodules along both sides of the vacuum tunnel.

FIG. 64 is a plan view of a preferred embodiment wherein a vacuum tunnelcart is configured with a cluster process cell through a transfer robot.

FIG. 65 shows the embodiment of FIG. 64 further including a plurality ofcluster process cells and a plurality of transfer robots along bothsides of the vacuum tunnel.

FIG. 66 is a plan view of a preferred embodiment wherein a vacuum tunnelcart is configured with a linear process cell through a transfer robot.

FIG. 67 shows the embodiment of FIG. 66 further including a plurality oflinear process cells.

FIG. 68 is a plan view of a preferred embodiment wherein a plurality ofcluster process cells and a plurality of linear process cells areconfigured with a tunnel transfer cart.

FIG. 69 shows the embodiment of FIG. 68 further including a plurality oftransfer carts.

FIG. 70 is a plan view of an alternate embodiment wherein alternatecluster processing cells are combined with both tunnel transport cartsystems and a linear processing group.

FIG. 71 is a plan view of an alternate embodiment wherein the tunnelforms a shape of an “L”.

FIG. 72 is a plan view of an alternate embodiment wherein the tunnelforms a shape of a “T”.

FIG. 73 is a plan view of an alternate embodiment wherein the tunnelforms a shape of a “U”.

FIG. 74 is a plan view of an alternate embodiment wherein both longduration processes and short processes are required.

FIG. 75 shows the embodiment of FIG. 74 with a plurality of transportcarts in the transport tunnel.

FIG. 76 is an alternate embodiment wherein a plurality tunnel transportcart systems are interconnected by work piece handling vacuum modules.

FIG. 77 shows the embodiment of FIG. 76 wherein the tunnel transportcart system forms a complete loop.

FIG. 78 shows an alternate embodiment depicting a complete processgroup.

FIG. 79 shows an embodiment of a work piece buffer zone in a vacuumprocessing system.

FIG. 80 shows dual side-by-side independent transport carts in a vacuumtunnel.

FIG. 81 shows a side view of dual vertically opposed independenttransport carts in a vacuum tunnel.

FIG. 82 shows an embodiment of transport cart with a robotic arm in aprocessing system that also includes transfer robots for work piecehandling.

FIG. 83 shows an embodiment of dual independent transport tunnels, eachwith a transport cart.

FIG. 84 shows an embodiment of the embodiment depicted in FIG. 83wherein a work piece elevator is used to move a work piece from thelower tunnel to the upper tunnel.

FIG. 85 is an embodiment of a system wherein two types of frog-leg stylerobots are configured as the main work piece handling transfer robots.

FIG. 86 illustrates another embodiment of the systems described herein.

FIGS. 87-91 illustrate additional embodiments using vertical liftersand/or elevators.

FIG. 92 shows a system for sharing metrology or lithography hardware.

FIG. 93 shows a linear processing system combining a cart in a tunnel, awork piece handling vacuum module, process modules, and a multi-functionmodule inline and parallel to the processing flow.

FIG. 94 depicts a side cut away view of a bypass capable thermaladjustment module with work piece handling vacuum module access.

FIG. 95 is a perspective view of a configurable multi-functionsemiconductor vacuum module as it would be used in a semiconductorvacuum processing system.

FIG. 96 shows a plurality of vacuum extension tunnels in a vacuumprocessing system.

FIG. 97 depicts the buffer aligner module with four stored semiconductorwork pieces.

FIGS. 98A-98C depict an alignment operation of the aligner of FIG. 97.

FIGS. 99A-99C depict an alignment of a second work piece in the alignerof FIG. 97.

FIGS. 100A and 100B depict a batch of aligned work pieces beingtransferred from the aligner of FIG. 97.

FIG. 101 depicts a vacuum module support pedestal in a vacuum processingsystem environment.

FIG. 102 is an exploded perspective view of a portion of a semiconductorprocessing system incorporating modular utility delivery modules.

FIG. 103 is a side view of a modular utility delivery system in anapplication with process chambers and elevated vacuum handling modules.

FIG. 104 shows a modular utility delivery module attached to a modularvacuum processing system.

FIG. 105 shows a side view of an embodiment of a low particle ventsystem used with a semiconductor vacuum module.

FIG. 106 shows a batch processing system.

FIGS. 107A and 107B show a robotic arm for use in a batch processingsystem.

FIGS. 108A-108C show a multi-shelf buffer for use in a batch processingsystem.

FIG. 109 shows a portion of an exemplary substrate processing system inaccordance with an aspect of an embodiment.

FIGS. 110A-110D show portions of an exemplary substrate processingsystem in accordance with an aspect of the embodiment of FIG. 109.

FIG. 111 shows the portion of the exemplary substrate processing systemof FIG. 109 with a portion of the processing cells removed.

FIG. 112 shows a side view of a substrate processing system inaccordance with an aspect of an embodiment.

FIG. 113 shows a portion of an exemplary substrate processing system inaccordance with an aspect of the embodiment of FIG. 109.

FIG. 114 shows a portion of an exemplary substrate processing system inaccordance with an aspect of the embodiment of FIG. 109.

DETAILED DESCRIPTION

FIG. 1 shows equipment architectures 1000 for a variety of manufacturingequipment types. Each type of manufacturing equipment handles items,such as semiconductor wafers, between various processes, such aschemical vapor deposition processes, etching processes, and the like. Assemiconductor manufacturing processes are typically extremely sensitiveto contaminants, such as particulates and volatile organic compounds,the processes typically take place in a vacuum environment, in one ormore process modules that are devoted to specific processes.Semiconductor wafers are moved by a handling system among the variousprocesses to produce the end product, such as a chip. Variousconfigurations 1000 exist for handling systems. A prevalent system is acluster tool 1002, where process modules are positioned radially arounda central handling system, such as a robotic arm. In other embodiments,a handling system can rotate items horizontally, such as in theembodiment 1004. An important aspect of each type of tool is the“footprint,” or the area that the equipment takes up in thesemiconductor manufacturing facility. The larger the footprint, the morespace required to accommodate multiple machines in a fabricationfacility. Also, larger footprints typically are associated with a needfor larger vacuum systems, which increase greatly in cost as theyincrease in size. The architecture 1004 rotates items in a “lazy susan”facility. The architecture in 1006 moves items in and out of a processmodule where the process modules are arranged next to each other. Thearchitecture 1008 positions process modules in a cluster similar to1002, with the difference that the central robot handles two wafers sideby side. Each of these systems shares many of the challenges of clustertools, including significant swap time delays as one wafer is moved inand another out of a given process module, as well as considerabledifficulty maintaining the cleanliness of the vacuum environment of agiven process module, as more and more wafers are moved through thesystem.

FIG. 2 shows a conventional cluster-type architecture 2000 for handlingitems in a semiconductor manufacturing process. A robotic arm 2004 movesitems, such as wafers, among various process modules 2002 that arepositioned in a cluster around the robotic arm 2004. An atmosphericsubstrate handling mini-environment chamber 2008 receives materials forhandling by the equipment and holds materials once processing iscomplete. Note how difficult it would be to add more process modules2002. While one more module 2002 would potentially fit, the practicalconfiguration is limited to five process modules 2002. Adding a sixthmodule may significantly impact the serviceability of the equipment, inparticular the robotic arm 2004.

FIGS. 3A and 3B show cluster tool modules, atmospheric minienvironmenthandling chambers, vacuum handling chambers and other components 3000from a flexible architecture system for a vacuum based manufacturingprocess. Different modules can be assembled together to facilitatemanufacturing of a desired process technology. For example, a given chipmay require chemical vapor deposition of different chemical constituents(e.g., Titanium Nitride, Tungsten, etc.) in different process modules,as well as etching in other process modules. The sequence of theprocesses in the different process modules produces a unique endproduct. Given the increasing complexity of semiconductor components, itis often desirable to have a flexible architecture that allows themanufacturer to add more process modules. However, the cluster toolsdescribed above are space-limited; therefore, it may be impossible toadd more process modules, meaning that in order to complete a morecomplex semiconductor wafer it may be necessary to move manufacturing toa second cluster tool. As seen in FIG. 3A and FIG. 3B, cluster tools caninclude configurations with two 3002, three 3004, four 3006, five 3008,3010 or six 3012 process modules with staged vacuum isolation. Othercomponents can be supplied in connection with the equipment.

FIG. 4 shows high-level components of a linear processing architecture4000 for handling items in a manufacturing process. The architectureuses two or more stationary robots 4002 arranged in a linear fashion.The robots 4002 can be either mounted in the bottom of the system orhang down from the chamber lid or both at the same time. The linearsystem uses a vacuum chamber 4012 around the robot. The system could becomprised of multiple connected vacuum chambers 4012, each with a vacuumchamber 4012 containing its own robot arranged in a linear fashion. Inembodiments, a single controller could be set up to handle one or moresections of the architecture. In embodiments vacuum chambers 4012sections are extensible; that is, a manufacturer can easily addadditional sections/chambers 4012 and thus add process capacity, muchmore easily than with cluster architectures. Because each section usesindependent robot drives 4004 and arms 4002, the throughput may stayhigh when additional sections and thus robots are added. By contrast, incluster tools, when the manufacturer adds process chambers 2002, thesystem increases the load for the single robot, even if that robot isequipped with a dual arm, eventually the speed of the robot can becomethe limiting factor. In embodiments, systems address this problem byadding additional robot arms 4002 into a single drive. Othermanufacturers have used a 4-axis robot with two completely independentarms such as a dual SCARA or dual Frog-leg robots. The linear systemdisclosed herein may not be limited by robot capacity, since eachsection 4012 contains a robot, so each section 4012 is able to transporta much larger volume of material than with cluster tools.

In embodiments the components of the system can be controlled by asoftware controller, which in embodiments may be a central controllerthat controls each of the components. In embodiments the components forma linkable handling system under control of the software, where thesoftware controls each robot to hand off a material to another robot, orinto a buffer for picking up by the next robot. In embodiments thesoftware control system may recognize the addition of a new component,such as a process module or robot, when that component is plugged intothe system, such as recognizing the component over a network, such as aUSB, Ethernet, firewire, Bluetooth, 802.11a, 802.11b, 802.11g or othernetwork. In such embodiments, as soon as the next robot, process module,or other component is plugged in a software scheduler for the flow of amaterial to be handled, such as a wafer, can be reconfiguredautomatically so that the materials can be routed over the new link inthe system. In embodiments the software scheduler is based on a neuralnet, or it can be a rule-based scheduler. In embodiments process modulescan make themselves known over such a network, so that the softwarecontroller knows what new process modules, robots, or other componentshave been connected. When a new process module is plugged into an emptyfacet, the system can recognize it and allow it to be scheduled into theflow of material handling.

In embodiments the software system may include an interface that permitsthe user to run a simulation of the system. The interface may allow auser to view the linking and configuration of various links, roboticarms and other components, to optimize configuration (such as by movingthe flow of materials through various components, moving processmodules, moving robots, or the like), and to determine whatconfiguration to purchase from a supplier. In embodiments the interfacemay be a web interface.

The methods and system disclosed herein can use optional buffer stations4010 between robot drives. Robots could hand off to each other directly,but that is technically more difficult to optimize, and would occupy tworobots, because they would both have to be available at the same time todo a handoff, which is more restrictive than if they can deposit to adummy location 4010 in-between them where the other robot can pick upwhen it is ready. The buffer 4010 also allows higher throughput, becausethe system does not have to wait for both robots to become available.Furthermore, the buffers 4010 may also offer a good opportunity toperform some small processing steps on the wafer such as heating,cooling, aligning, inspection, metrology, testing or cleaning.

In embodiments, the methods and systems disclosed herein use optionalvacuum isolation valves 4006 between robot areas/segments 4012. Eachsegment 4012 can be fully isolated from any other segment 4012. If arobot handles ultra clean and sensitive materials (e.g., wafers) in itssegment 4012, then isolating that segment 4012 from the rest of thesystem may prevent cross-contamination from the dirtier segment 4012 tothe clean segment 4012. Also the manufacturer can now operate segments4012 at different pressures. The manufacturer can have stepped vacuumlevels where the vacuum gets better and better further into the machine.The big advantage of using vacuum isolation valves 4006 between segments4012 may be that handling of atomically clean wafers (created aftercleaning steps and needing to be transported between process moduleswithout contamination from the environment) can be done withoutout-gassing from materials or wafers in other parts of the systementering the isolated chamber segment 4012.

In embodiments, vacuum isolation between robots is possible, as ismaterial buffering between robots, such as using a buffer module 4010, amini-process module or an inspection module 4010.

FIG. 5 shows a top view of a linear processing system 4000, such as onewith a linear architecture similar to that of FIG. 4.

Different forms of robots can be used in semiconductor manufacturingequipment, whether a cluster tool or a linear processing machine such asdisclosed in connection with FIGS. 4 and 5.

FIGS. 6A and 6B show a 3-link SCARA arm 6002 and a 4-link SCARA arm6004. The 3-link or 4-link arms 6002, 6004 are driven by a robot drive.The 3-link arm 6002 is commonly used in industry. When the 3-link SCARAarm 6002 is used, the system is not optimized in that thereach-to-containment ratio is not very good. Thus, the vacuum chambersneed to be bigger, and since costs rise dramatically with the size ofthe vacuum chamber, having a 3-link SCARA arm 6002 can increase the costof the system. Also the overall footprint of the system becomes biggerwith the 3-link SCARA arm 6002. Moreover, the reach of a 3-link SCARAarm 6002 is less than that of a 4-link arm 6004. In some cases amanufacturer may wish to achieve a large, deep handoff into a processmodule, and the 4-link arm 6004 reaches much farther beyond itscontainment ratio. This has advantages in some non-SEMI-standard processmodules. It also has advantages when a manufacturer wants to cover largedistances between segments.

The 4-link arm 6004 is advantageous in that it folds in a much smallercontainment ratio than a 3-link SCARA arm 6002, but it reaches a lotfurther than a conventional 3-link SCARA 6002 for the same containmentdiameter. In combination with the ability to have a second drive andsecond 4-link arm 6004 mounted on the top of the system, it may allowfor a fast material swap in the process module. The 4-link SCARA arm6004 may be mounted, for example, on top of a stationary drive asillustrated, or on top of a moving cart that provides the transmissionof the rotary motion to actuate the arms and belts. In either case, the4-link arm 6004, optionally together with a second 4-link arm 6004, mayprovide a compact, long-reach arm that can go through a small opening,without colliding with the edges of the opening.

FIG. 7 shows reach and containment characteristics of a 4-link SCARA arm7004. In embodiments, the 4-link SCARA arm 7004 link lengths are notconstrained by the optimization of reach to containment ratio as in someother systems. Optimization of the reach to containment ratio may leadto a second arm member that is too long. When the arm reaches through aslot valve that is placed as close as practical to the minimumcontainment diameter, this second arm member may collide with the insideedges of the slot valve. Thus the second (and third) links may bedimensioned based on collision avoidance with a slot valve that the armis designed to reach through. This results in very different ratiosbetween L1, L2 and L3. The length of L2 may constrain the length of L3.An equation for optimum arm length may be a 4th power equation amenableto iterative solutions.

FIG. 8 shows high-level components for a robot system 8002, including acontroller 8004, a drive/motor 8008, an mm 8010, an end effector 8012,and a material to be handled 8014.

FIG. 9 shows components of a dual-arm 9002 architecture for a roboticarm system for use in a handling system. One arm is mounted from thebottom 9004 and the other from the top 9008. In embodiments both are4-link SCARA arms. Mounting the second arm on the top is advantageous.In some other systems arms have been connected to a drive that ismounted through the top of the chamber, but the lower and upper drivesare conventionally mechanically coupled. In embodiments, there is nomechanical connection between the two drives in the linear systemdisclosed in connection with FIG. 4 and FIG. 5; instead, thecoordination of the two arms (to prevent collisions) may be done in asoftware system or controller. The second (top) arm 9008 may optionallybe included only if necessary for throughput reasons.

Another feature is that only two motors, just like a conventional SCARAarm, may be needed to drive the 4-link arm. Belts in the arm maymaintain parallelism. Parallelism or other coordinated movements mayalso be achieved, for example, using parallel bars instead of belts.Generally, the use of only two motors may provide a substantial costadvantage. At the same time, three motors may provide a functionaladvantage in that the last (L4) link may be independently steered,however the additional belts, bearings, connections, shafts and motormay render the system much more expensive. In addition the extra beltsmay add significant thickness to the arm mechanism, making it difficultto pass the arm through a (SEMI standard) slot valve. Also, the use offewer motors generally simplifies related control software.

Another feature of the 4-link SCARA arm disclosed herein is that thewrist may be offset from centerline. Since the ideal system has atop-mount 9008 as well as a bottom 9004 mount 4-link arm, the verticalarrangement of the arm members may be difficult to adhere to if themanufacturer also must comply with the SEMI standards. In a nutshell,these standards specify the size and reach requirements through a slotvalve 4006 into a process module. They also specify the level abovecenterline on which a wafer has to be carried. Many existing processmodules are compliant with this standard. In systems that arenon-compliant, the slot valves 4006 are of very similar shape althoughthe opening size might be slightly different as well as the definitionof the transfer plane. The SEMI standard dimensional restrictionsrequire a very compact packaging of the arms. Using an offset wristallows the top 9008 and bottom 9004 arms to get closer together, makingit easier for them to pass through the slot valve 4006. If the wrist isnot offset, then the arms need to stay further apart vertically andwafer exchanges may take more time, because the drives need to move morein the vertical direction. The proposed design of the top arm does notrequire that there is a wrist offset, but a wrist offset mayadvantageously reduce the turn radius of the system, and allows for abetter mechanical arm layout, so no interferences occur.

FIG. 10 shows reach and containment capabilities of a 4-link SCARA arm6004.

FIG. 11 shows interference characteristics 1102 of a 4-link SCARA arm6004. The wrist offset may help to fold the arm in a smaller space thanwould otherwise be possible.

FIG. 12 shows a side view of a dual-arm set of 4-link SCARA arms 6004.Because of the packaging constraints of particularly the top arm, it maybe necessary to construct an arm that has some unique features. Inembodiments, one link upon retracting partially enters a cutout inanother arm link. Belts can be set in duplicate, rather than a singlebelt, so that one belt is above 12004 and one below 12008 the cutout.One solution, which is independent of the fact that this is a 4-linkarm, is to make L2 significantly lower 12002, with a vertical gap to L1,so that L3 and L4 can fold inside. Lowering L2 12002 may allow L3 and LAto reach the correct transfer plane and may allow a better containmentratio. Because of the transfer plane definition, the lowering of L212002 may be required.

FIG. 13 shows an embodiment in which a combination of belts and linkagesis used. The transmission of motion through L1 13002 and L3 13006 may beaccomplished by either a single belt or a dual belt arrangement. Incontrast, the motion transmission in L2 13004 may be accomplished by amechanical linkage (spline) 13010. The advantage of such an arrangementmay be that enclosed joints can be used which reduces the verticaldimension of the arm assembly that may allow an arm to more easily passthrough a SEMI standard slot valve.

FIG. 14 shows an external return system for a handling system having alinear architecture 14000. The return mechanism is optionally on the topof the linear vacuum chamber. On conventional vacuum handling systems,the return path is often through the same area as the entry path. Thisopens up the possibility of cross contamination, which occurs when cleanwafers that are moving between process steps get contaminated byresiduals entering the system from dirty wafers that are not yetcleaned. It also makes it necessary for the robot 4002 to handlematerials going in as well as materials going out, and it makes itharder to control the vacuum environment. By exiting the vacuum systemat the rear and moving the wafers on the top back to the front in an airtunnel 14012, there are some significant advantages: the air return mayrelatively cheap to implement; the air return may free up the vacuumrobots 4002 because they do not have to handle materials going out; andthe air return may keep clean finished materials out of the incomingareas, thereby lowering cross-contamination risks. Employing a smallload lock 14010 in the rear may add some costs, and so may the airtunnel 14012, so in systems that are short and where vacuum levels andcross contamination are not so important, an air return may have lessvalue, but in long systems with many integrated process steps theabove-system air return could have significant benefits. The returnsystem could also be a vacuum return, but that would be more expensiveand more complicated to implement. It should be understood that while insome embodiments a load lock 14010 may be positioned at the end of alinear system, as depicted in FIG. 14, the load lock 14010 could bepositioned elsewhere, such as in the middle of the system. In such anembodiment, a manufacturing item could enter or exit the system at suchanother point in the system, such as to exit the system into the airreturn. The advantage of a mid-system exit point may be that in case ofa partial system failure, materials or wafers can be recovered. Theadvantage of a mid-system entry point may be that wafers can be insertedin multiple places in the system, allowing for a significantly moreflexible process flow. In effect, a mid system entry or exit positionbehaves like two machines connected together by the mid-system position,effectively eliminating an EFEM position. It should also be understoodthat while the embodiment of FIG. 14 and subsequent figures IS astraight line system, the linear system could be curvilinear; that is,the system could have curves, a U- or V-shape, an S-shape, or acombination of those or any other curvilinear path, in whatever formatthe manufacturer desires, such as to fit the configuration of afabrication facility. In each case the system optionally includes anentry point and an exit point that is down the line (although optionallynot a straight line) from the entry point. Optionally the air returnreturns the item from the exit point to the entry point. Optionally thesystem can include more than one exit point. In each case the roboticarms described herein can assist in efficiently moving items down theline, without the problems of other linear systems. FIG. 14A shows anexample of a U-shaped linear system.

Referring still to FIG. 14, an embodiment of the system uses a dualcarrier mechanism 14008 so that wafers that are finished can quickly bereturned to the front of the system, but also so that an empty carrier14008 can be placed where a full one was just removed. In embodimentsthe air return will feature a carrier 14008 containing N wafers. N canbe optimized depending on the throughput and cost requirements. Inembodiments the air return mechanism may contain empty carriers 14008 sothat when a full carrier 14018 is removed from the vacuum load lock14010, a new empty carrier 14008 can immediately be placed and load lock14010 can evacuated to receive more materials. In embodiments the airreturn mechanism may be able to move wafers to the front of the system.At the drop-off point a vertical lift 14004 may be employed to lower thecarrier to a level where the EFEM (Equipment Front End Module) robot canreach. At the load lock point(s) the vertical lift 14004 can lower topick an empty carrier 14008 from the load lock.

In embodiments the air return mechanism may feature a storage area 14014for empty carriers 14008, probably located at the very end and behindthe location of the load lock 14010. The reason for this is that whenthe load lock 14010 releases a carrier 14018, the gripper 14004 can gripthe carrier 14018 and move it forward slightly. The gripper 14004 canthen release the full carrier 14018, move all the way back and retrievean empty carrier 14008, place it on the load lock 14010. At this pointthe load lock 14010 can evacuate. The gripper 14004 can now go back tothe full carrier 14018 and move it all the way to the front of thesystem. Once the carrier 14018 has been emptied by the EFEM, it can bereturned to the very back where it waits for the next cycle.

It is also possible to put the lift in the load lock rather than usingthe vertical motion in the gripper, but that would be more costly. Itwould also be slightly less flexible. A manufacturer may want a verticalmovement of the carrier 14018 in a few places, and putting it in thegripper 14004 would be more economical because the manufacturer thenonly needs one vertical mechanism.

FIG. 15 shows certain additional details of an external return systemfor a handling system of FIG. 14.

FIG. 16 shows additional details of an external return system for ahandling system of FIG. 14.

FIG. 17 shows movement of the output carrier 14018 in the return tunnel14012 of FIG. 14.

FIG. 18 shows handling of an empty carrier 14008 in the return system14012 of FIG. 14.

FIG. 19 shows movement of the empty carrier 14008 in the return tunnel14012 of FIG. 14 into a load lock 14010 position.

FIG. 20 shows the empty carrier 14008 lowered and evacuated and movementof the gripper 14004 in the return system of FIG. 14.

FIG. 21 shows an empty carrier 14008 receiving material as a fullcarrier 14018 is being emptied in the return tunnel 14012 of FIG. 14.

FIG. 22 shows an empty carrier 14008 brought to a holding position,starting a new return cycle in the return tunnel 14012 of FIG. 14.

FIG. 23 shows an architecture for a handling facility for amanufacturing process, with a dual-arm robotic arm system 23002 and areturn system in a linear architecture.

FIG. 24 shows an alternative embodiment of an overall systemarchitecture for a handling method and system of the disclosedembodiment.

FIG. 25 shows a comparison of the footprint of a linear system 25002 ascompared to a conventional cluster system 25004. Note that with thelinear system 25002 the manufacturer can easily extend the machine withadditional modules without affecting system throughput. For example, asshown in FIG. 25A, for the vacuum section only, W=2*750+2*60+440=2060.Similarly, D=350*2+440*1.5+3*60+745/2=1913, and A=3.94 m². With respectto FIG. 25B, for the vacuum section only, W=2*750+2*60+1000=2620.Similarly, D=920+cos(30)*(500+60+750)+sin(30)*745/2=2174; accordingly,A=6.9 m², which is 45% bigger.

FIG. 26 shows a linear architecture deployed with oversized processmodules 26002 in a handling system in accordance with aspects of thedisclosed embodiment.

FIG. 27 shows a rear-exit architecture for a handling system inaccordance with aspects of the disclosed embodiment.

FIG. 28 shows a variety of layout possibilities for a fabricationfacility employing linear handling systems in accordance with variousaspects of the disclosed embodiment.

FIG. 29 shows an aspect of the disclosed embodiment wherein a robot29002 may include multiple drives 29004 and/or multiple controllers29008. In embodiments a controller 29008 may control multiple drives29004 as well as other peripheral devices such as slot valves, vacuumgauges, thus a robot 29002 may be a controller 29008 with multipledrives 29004 or multiple controllers 29008 with multiple drives 29004.

FIG. 30 shows transfer plane 30002 and slot valve 30004 characteristicsrelevant to aspects of the disclosed embodiment.

FIG. 31 shows a tumble gripper 31002 for centering wafers. The advantageof the tumble gripper 31002 over the passive centering gripper 32002 inFIG. 32 is that there is less relative motion between the tumblers 31004and the back-side of the wafer 31008. The tumblers 31004 may gentlynudge the wafer 31008 to be centered on the end effector, supporting iton both sides as it moves down. In certain manufacturing processes itmay be desirable to center wafers 31008, such as in a vacuumenvironment. The tumble gripper 31004 may allow the handling of veryfragile wafers 31008, such as when employing an end effector at the endof a robotic arm, because it supports both ends of the wafer duringhandling.

FIG. 32 shows a passively centering end effector 32002 for holdingwafers 31008. The wafer 31008 is typically slightly off-center when theend effector lifts (or the wafer 31008 is lowered). This results in thewafer 31008 sliding down the ramp and dropping into the cutout 32004.This can result in the wafer 31003 abruptly falling or moving, which inturn can create particles.

The methods and systems disclosed herein offer many advantages in thehandling of materials or items during manufacturing processes. Amongother things, vacuum isolation between robots may be possible, as wellas material buffering between robots. A manufacturer can return finishedwafers over the top of the system without going through vacuum, whichcan be a very substantial advantage, requiring only half the necessaryhandling steps, eliminating cross contamination between finished andunfinished materials and remaining compatible with existing clean roomdesigns. When a manufacturer has relatively dirty wafers entering thesystem, the manufacturer may want to isolate them from the rest of themachine while they are being cleaned, which is usually the first step inthe process. It may be advantageous to keep finished or partiallyfinished materials away from the cleaning portion of the machine.

Other advantages may be provided by the methods and systems disclosedherein. The dual arms (top mounted and bottom mounted) may work incoordinated fashion, allowing very fast material exchanges. Regardlessof the exact arm design (3-link, 4-link or other), mounting an arm inthe lid that is not mechanically connected to the arm in the bottom canbe advantageous. The link lengths of the 4-link SCARA arm providedherein can be quite advantageous, as unlike conventional arms they aredetermined by the mechanical limits of slot valves and chamber radius.The 4-link SCARA arms disclosed herein are also advantageous in thatthey can use two motors for the links, along with a Z motor, rather thanthree motors plus the Z motor.

A linear vacuum system where materials exit in the rear may offersubstantial benefits. Another implementation may be to have both theentry system and exit system installed through two opposing walls.

The 4-link SCARA arm disclosed herein may also allow link L3 to swinginto and over link L2 for the top robot drive. This may not be easilydone with the 3-link SCARA, nor with existing versions of 4-link SCARAarms, because they have the wrong link lengths.

The gripper for carriers and the multiple carrier locations in thelinear system may also offer substantial benefits in materials handlingin a linear manufacturing architecture. Including vertical movement inthe gripper and/or in the rear load lock may offer benefits as well.

While the aspects of the disclosed embodiment have been described inconnection with certain preferred embodiments, one of ordinary skill inthe art will recognize other embodiments that are encompassed herein.

FIG. 33 illustrates a fabrication facility including a mid-entry point33022. In an embodiment, the fabrication facility may include a loadlock 14010 midstream 33002 where wafers 31008 can be taken out orentered. There can be significant advantages to such a system, includingproviding a processing facility that provides dual processingcapabilities (e.g. connecting two machines behind each other, but onlyneed to use one EFEM). In an embodiment, the air return system 14012 canalso take new wafers 31008 to the midpoint 33022 and enter wafers 31008there.

FIG. 34 illustrates several top views of a fabrication facility withmid-entry points 33002. The figure also illustrates how the combinationof a mid-entry point effectively functions to eliminate one of the EFEMs34002.

FIG. 35 illustrates a fabrication facility including a series of sensors35002. In many fabrication facilities such sensors 35002 are commonlyused to detect whether a material 35014 is still present on a roboticarm 35018. Such sensors 35002 may be commonly placed at each vacuumchamber 4012 entry and exit point. Such sensors 35002 may consist of avertical optical beam, either employing an emitter and detector, oremploying a combination emitter/detector and a reflector. In a vacuumhandling facility, the training of robotic stations is commonlyaccomplished by a skilled operator who views the position of the robotarm and materials and adjusts the robot position to ensure that thematerial 35014 is deposited in the correct location. However, frequentlythese positions are very difficult to observe, and parallax and otheroptical problems present significant obstacles in properly training arobotic system. Hence a training procedure can consume many hours ofequipment downtime.

Several automated training applications have been developed, but theymay involve running the robotic arm into a physical obstacle such as awall or edge. This approach has significant downsides to it: physicallytouching the robot to an obstacle risks damage to either the robot orthe obstacle, for example many robot end effectors are constructed usingceramic materials that are brittle, but that are able to withstand veryhigh wafer temperatures. Similarly, inside many process modules thereobjects that are very fragile and easily damaged. Furthermore, it maynot be possible to employ these auto-training procedures with certainmaterials, such as a wafer 31008 present on the robot end effector.Moreover, the determination of vertical position is more difficultbecause upward or downward force on the arm caused by running into anobstacle is much more difficult to detect.

In the systems described herein, a series of sensors 35002-35010 mayinclude horizontal sensors 35004-35010 and vertical sensors 35002. Thiscombination of sensors 35002-35010 may allow detection, for examplethrough optical beam breaking, of either a robotic end effector, arm, ora handled object. The vertical sensor 35002 may be placed slightlyoutside the area of the wafer 31008 when the robotic arm 35018 is in aretracted position. The vertical sensor 35002 may also, or instead, beplaced in a location such as a point 35012 within the wafer that iscentered in front of the entrance opening and covered by the wafer whenthe robot is fully retracted. In this position the sensor may be able totell the robotic controller that it has successfully picked up a wafer31008 from a peripheral module.

Horizontal sensors 35004-35010 may also be advantageously employed. Invacuum cluster tools, horizontal sensors 35004-35010 are sometimesimpractical due to the large diameter of the vacuum chamber, which maymake alignment of the horizontal sensors 35004-35010 more complicated.In the systems described above, the chamber size may be reducedsignificantly, thus may make it practical to include one or morehorizontal sensors 35004-35010. [00205]FIG. 36 illustrates otherpossible locations of the horizontal sensors 35004-35010 and verticalsensors 35002, such as straight across the chamber (36002 and 36008)and/or through mirrors 36006 placed inside the vacuum system.

FIG. 37 illustrates a possible advantage of placing the sensor 35002slightly outside the wafer 37001 radius when the robot arm is fullyretracted. During a retract motion the sensor 35002 detects the leadingedge of the wafer 37001 at point “a” 37002 and the trailing edge atpoint “b” 37004. These results may indicate that the wafer 37001 wassuccessfully retrieved, but by tying the sensor 35002 signal to theencoders, resolvers or other position elements present in the roboticdrive, one can also calculate if the wafer 37001 is centered withrespect to the end effector. The midpoint of the line segment “a-b”3700237004 should correspond to the center of the end effector becauseof the circular geometry of a wafer 37001. If the wafer 37001 slips onthe end effector, inconsistent length measurements may reveal theslippage.

Additionally, during a subsequent rotation and movement, a second linesegment “c-d” 37008, 37010 may be detected when the wafer 37001 edgespass through the sensor. Again, the midpoint between “c” 37008 and “d”37010 should coincide with the center of the end effector, and maypermit a measurement or confirmation of wafer centering.

The above method may allow the robot to detect the wafer 37001 as wellas determine if the wafer 37001 is off-set from the expected location onthe end effector.

The combination of horizontal and vertical sensors 35002-35010 may allowthe system to be taught very rapidly using non-contact methods: therobotic arm and end effectors may be detected optically without the needfor mechanical contact. Furthermore, the optical beams can be usedduring real-time wafer 37001 handling to verify that wafers 37001 are inthe correct position during every wafer 37001 handling move.

FIG. 38 illustrates a conventional vacuum drive 38000 with two rotaryaxes 38020 and 38018 and a vertical (Z) axis 38004. A bellows 38016 mayallow for the vertical Z-axis 38002 motion. A thin metal cylinder 38024affixed to the bottom of the bellows 18016 may provide a vacuum barrierbetween the rotor and the stator of the motors 38010 and 38014. Thisarrangement may require in-vacuum placement of many components:electrical wires and feedthroughs, encoders, signal LEDs and pick-ups38008, bearings 38012, and magnets 38006. Magnets 38006, bearings 38012,wires and connectors, and encoders can be susceptible to residualprocessing gasses present in the vacuum environment. Furthermore, it maybe difficult to remove gasses trapped in the bottom of the cylinder38024, as the gasses may have to follow a convoluted path 38022 whenevacuated.

FIG. 39 illustrates a vacuum robot drive 39000 that may be used with thesystems described herein. The rotary drive forces may be provided by twomotor cartridges 39004 and 39006. Each cartridge may have an integralencoder 39008, bearings 39018 and magnets 39020. Some or all of thesecomponents may be positioned outside the vacuum envelope. A concentricdual-shaft rotary seal unit 39016 may provide vacuum isolation for therotary motion using, for example, lip-seals or ferrofluidic seals. Thisapproach may reduce the number of components inside the vacuum system.It may also permit servicing of the motors 39004, 39006 and encoders39008 without breaking vacuum, thereby increasing serviceability of thedrive unit.

FIG. 40A shows a stacked vacuum load lock 4008, 40004 for enteringmaterials into a vacuum environment. One limiting factor on bringingwafers 31008 into a vacuum system is the speed with which the load lockcan be evacuated to high vacuum. If the load lock is pumped too fast,condensation may occur in the air in the load lock chamber, resulting inprecipitation of nuclei on the wafer 31008 surfaces, which can result inparticles and can cause defects or poor device performance. Clustertools may employ two load locks side by side, each of which isalternately evacuated. The pumping speed of each load lock can thus beslower, resulting in improved performance of the system. With two loadlocks 4008 40004 in a vertical stack, the equipment footprint stays verysmall, but retains the benefit of slower pumping speed. In embodiments,the load lock 40004 can be added as an option. In embodiments therobotic arms 4004 and 40006 can each access either one of the two loadlocks 4008 40004. In embodiments the remaining handoff module 7008 couldbe a single level handoff module.

FIG. 40B shows another load lock layout. In this figure wafers 31008 canbe entered and can exit at two levels on either side of the system, butfollow a shared level in the rest of the system.

FIG. 41 details how the previous concept of stacked load locks 400840004 can be also implemented throughout a process by stacking twoprocess modules 41006, 41008. Although such modules would not becompliant with the SEMI standard, such an architecture may offersignificant benefits in equipment footprint and throughput.

FIG. 42 shows a system with two handling levels 4008, 40004, 4010,42004: wafers may be independently transported between modules usingeither the top link 40006 or the bottom link 4004. Optionally; eachhandling level may have two load locks to provide the advantage ofreduced evacuation speed noted above. Thus a system with four input loadlocks, two handling levels, and optionally four output load locks, isalso contemplated by description provided herein, as are systems withadditional load lock and handling levels.

FIG. 43 shows a top view of the system of FIG. 42.

FIG. 44 depicts a special instrumented object 44014, such as a wafer.One or more sensors 44010 may be integrated into the object 44014, andmay be able to detect environmental factors around the object 44014. Thesensors 44010 may include proximity sensors such as capacitive, opticalor magnetic proximity sensors. The sensors 44010 may be connected to anamplifier/transmitter 44012, which may use battery power to transmitradio frequency or other sensor signals, such as signals conforming tothe 802.11b standard, to a receiver 44004.

In many instances it may be difficult or impossible to putinstrumentation on an object 44014 used to train a robot, because thewires that are needed to power and communicate to the instruments andsensors interfere with proper robotic motion or with the environmentthat the robot moves through. By employing a wireless connection to theobject, the problem of attached wires to the object may be resolved.

The object 44014 can be equipped with numerous sensors of differenttypes and in different geometrically advantageous patterns. In thepresent example, the sensors 1 through 6 (44010) are laid out in aradius equal to the radius of the target object 44008. In embodimentsthese sensors are proximity sensors. By comparing the transient signalsfrom the sensors 44010, for example sensor 1 and sensor 6, it can bedetermined if the object 44014 is approaching a target 44008 at thecorrect orientation. If the target 44008 is not approached correctly,one of the two sensors 44010 may show a premature trigger. By monitoringmultiple sensors 44010, the system may determine if the object 44010 isproperly centered above the target 44008 before affecting a hand off.The sensors 44010 can be arranged in any pattern according to, forexample, efficiency of signal analysis or any other constraints. Radiofrequency signals also advantageously operate in a vacuum environment.

FIG. 45 shows the system of FIG. 44 in a side orientation illustratingthe non-contact nature of orienting the instrumented object 44014 to atarget 44008. The sensors 44010 may include other sensors for measuringproperties of the target 44008, such as temperature.

FIG. 46 depicts radio frequency communication with one or more sensors,a radio frequency sensor signal 44016 may be transmitted to an antenna46002 within a vacuum. Appropriate selection of wavelengths may improvesignal propagation with a fully metallic vacuum enclosure. The use ofsensors in wireless communication with an external receiver andcontroller may provide significant advantages. For example, thistechnique may reduce the time required for operations such as findingthe center of a target, and information from the sensor(s) may beemployed to provide visual feedback to an operator, or to automatecertain operations using a robotic arm. Furthermore, the use of one ormore sensors may permit measurements within the chamber that wouldotherwise require release of the vacuum to open to atmosphere andphysically inspect the chamber. This may avoid costly or time consumingsteps in conditioning the interior of the chamber, such asdepressurization and baking (to drive out moisture or water vapor).

FIG. 47 illustrates the output from multiple sensors 44010 as a functionof the robot movement. When the robot moves over the target 44008 themotion may result in the sensors providing information about, forexample, distance to the target 44003 if the sensors are proximitysensors. The signals can be individually or collectively analyzed todetermine a location for the target 44008 relative to the sensors.Location or shape may be resolved in difference directions by moving thesensor(s) in two different directions and monitoring sensor signals,without physically contacting the target 44008.

FIG. 48 depicts a technique for inserting and removing wafers 48008 froma vacuum system. One or more heating elements, such as a set of heatingelements 48002, 48004, and 48006 may be employed, individually or incombination, to heat a chamber 4008 and a substrate material 48008 to anelevated temperature of 50° C. to 400° C. or more. This increase instarting temperature may mitigate condensation that would otherwiseoccur as pressure decreases in the chamber, and may allow for a morerapid pump down sequence to create a vacuum. When heated wafers 48008are moved to the load lock 4008 by the robotic arm 4002, they may besignificantly warmer than heating units 48004, 48006, such that theheating units 48004, 48006 may cool the wafers on contact. A heatingpower supply may regulate heat provided to the heating units 48004,48006 to maintain a desired temperature for the heating units and/orwafers. A suitable material selection for the heating units 48004, 48006may result in the system reacting quickly to heating power changes,resulting in the possibility of different temperature settings fordifferent conditions, for example a higher temperature setting duringpumpdown of the chamber 4008 and a lower setting during venting ofchamber 4008.

Preheating the wafers 48008 may reduce condensation and particles whilereducing process time. At the same time, the wafers 48008 may be too hotwhen exiting the system, such that they present a safety hazard, or melthandling and support materials such as plastic. Internal temperatures ofabout 80 to 100° C. degrees, and external temperatures of about 50° C.degrees or less may, for example, meet these general concerns.

FIG. 49 illustrates a robotic end effector 49002. The robotic endeffector 49002 may be tapered so that it has a non-uniform thicknessthrough one or more axes. For example, the robotic end effector 49002may have a taper when viewed from the side or from the top. The tapermay mitigate resonant vibrations along the effector 49002. At the sametime, a relatively narrow cross-sectional profile (when viewed from theside) may permit easier maneuvering between wafers 49006. The side-viewtaper may be achieved by grinding or machining, or by a casting processof the effector 49002 with a taper. Materials such as Aluminum SiliconCarbide (AlSiC 9) may be advantageously cast into this shape to avoidsubsequent machining or other finishing steps. A casting process offersthe additional advantage that the wafer support materials 49004 can becast into the mold during the casting process, thereby reducing thenumber of components that require physical assembly.

As shown in FIG. 50, similar techniques may be applied to robotic armsegments 50002 and 50004. The same dampening effect may be achieved toattenuate resonant vibrations in the arm segments 50002, 50004 asdescribed above. The tapered shape may be achieved using a variety ofknown processes, and may allow more rapid movement and more precisecontrol over a resulting robotic arm segment.

FIG. 51 shows a dual independent SCARA arm employing five motors 51014.Each lower arm 51002 and 51008 can be independently actuated by themotors 51014. The arms are connected at the distal end to upper arms51004 and 51010. The configuration gives a relatively small retractradius, but a somewhat limited extension.

FIG. 52 shows a dual dependent SCARA arm employing 4 motors 52010. Thelinks 52002 and 52004 may be common to the end effectors 52006 and52008. The motors 52010 may control the end effectors 52006 and 52008 insuch a way that during an extension motion of the lower arm 52002, thedesired end effector, (say 52008) may be extended into the processingmodules, whereas the inactive end effector (say 52006} may be pointedaway from the processing module.

FIG. 53 shows a frog-leg style robotic arm. The arm can be used inconnection with various embodiments described herein, such as to enablepassing of work pieces, such as semiconductor wafers, from arm-to-arm ina series of such arms, such as to move work pieces among semiconductorprocess modules.

FIG. 54 shows a dual frog-leg arm that can be employed in a planarrobotic system, such as one of the linear, arm-to-arm systems describedin this disclosure.

FIG. 55A illustrates a 4-Link SCARA arm as described in this disclosuremounted to a cart 55004. Such a cart may move in a linear fashion by aguide rail or magnetic levitation track 55008 and driven by a motor55002 internal or external to the system. The 4-Link SCARA arm has theadvantage that it fold into a smaller retract radius than a 3-Link SCARAarm, while achieving a larger extension into a peripheral module such asa process module all the while avoiding a collision with the openingthat the arm has to reach through. An inverted cart 55006 could be usedto pass substrates over the cart 55004.

FIG. 55B shows a top view of the system described in FIG. 55A.

FIG. 56 illustrates a linear system described in this disclosure using acombination of dual independent and single SCARA robotic arms. Such asystem may not be as compact as a system employing a 4-Link SCARA armrobotic system.

FIG. 57 demonstrates a vertically stacked handling system employing a0.4-Link SCARA robotic arm, where the arm can reach any and all of theperipheral process modules 5002. By rotating the process modules in thetop level 57004 by approximately 45 degrees and mounting the top levelcomponents to the bottom level chambers 57002, the top and bottom ofeach of the process modules may remain exposed for service access aswell as for mounting components such as pumps, electrodes, gas lines andthe like. The proposed layout may allow for the combination of sevenprocess modules 5002 in a very compact space.

FIG. 58A illustrates a variation of FIG. 57, where the bottom level58002 of the system consists of a plurality of robotic systems asdescribed in this disclosure and the top level system 58004 employsprocess modules 5002 oriented at a 45 degree angle to the main systemaxis. The proposed layout allows for the combination of nine processmodules 5002 in a very compact space.

FIG. 58B illustrates a variation of FIG. 58A with the use of a rear-exitload lock facility to remove substrates such as semiconductor wafersfrom the system.

FIG. 59A shows a linear handling system accommodating large substrateprocessing modules 59004 while still allowing for service access 59002,and simultaneously still providing locations for two standard sizedprocess module 5002.

FIG. 59B demonstrates a system layout accommodating four large processmodules 59004 and a standard sized process module 5002 while stillallowing service access 59002 to the interior of the process modules5002.

FIG. 60 shows a dual frog robot with arms substantially on the same sideof the robotic drive component. The lower arms 60002 support two sets ofupper arms 60004 which are mechanically coupled to the motor set 54010.

A variety of techniques may be used to handle and transport waferswithin semiconductor manufacturing facilities such as those describedabove. It will be understood that, while certain processing modules,robotic components, and related systems are described above, othersemiconductor processing hardware and software may be suitably employedin combination with the transport and handling systems described below.All such variations and modifications that would be clear to one ofordinary skill in the art are intended to fall within the scope of thisdisclosure.

Referring to FIG. 61, in a vacuum processing system, a process group6100 may include a handling interface 6110 such as an equipment frontend module connected to an exchange zone 6120, and may be furtherconnected to a work piece handling vacuum module 6130 that transferswork pieces from the exchange zone 6120 to a transport cart 6140 insidea transport tunnel 6150.

In order to facilitate discussion of various transport/handling schemes,the combination of the transfer robot 6131 with one or more processmodules 2002 is referred to herein as a process cell 6170. It should beunderstood that process cells may have many configurations includingconventional or unconventional process modules and/or cluster tools thatperform a wide range of processes, along with associated or additionalrobotics for transferring wafers. This may include commerciallyavailable process modules, custom process modules, and so forth, as wellas buffers, heaters, metrology stations, or any other hardware orcombination of hardware that might receive wafers from or provide wafersto a wafer transportation system. Process modules 2002 and/or processcells 6170 may be disposed in various configurations, such as inclusters, aligned along the sides of a line or curve, in square orrectangular configurations, stacked vertically, or the like. Similarly,one or more robots 6131 that service process cells 6170 can beconfigured many ways, to accommodate different configurations of processmodules, including in vertically stacked or opposing positions, in linewith each other, or the like.

The process group 6100 may further include one or more isolation valves6180 such as slot valves or the like that selectively isolate vacuumzones within the group 6100 and facilitate work piece interchangebetween vacuum zones. The isolation valves 6180 may provide control tomaintain a proper vacuum environment for each work piece during one ormore processing steps, while permitting intermittent movement of workpieces between vacuum zones.

In the embodiment of FIG. 61, the work piece handling vacuum modules6130 and 6131 transfer work pieces between other components of the group6100, and more particularly transfer work pieces between the transportcart 6140 and various destinations. The transport cart 6140 isresponsible for moving a work piece from destination to destination,such as among the work piece handling vacuum modules 6130 and 6131. Invarious layouts for fabrication facilities, process modules and the likemay be too far separated for direct or convenient work piece transferusing robots, such as the robots 6130, 6131 shown in FIG. 61. This mayarise for a number of reasons, such as the size or shape of processingmodules, the positions of entry and exit points for process modules, thenumber of process modules in a particular fabrication layout, and soforth. As a significant advantage, the use of one or more transportcarts 6140 as an intermediate transportation system permits flexibleinterconnection of a wide variety of modules and other equipment intocomplex, multi-purpose processing facilities.

The transport cart 6140 may transport a work piece, such as asemiconductor wafer, to a position accessible by the work piece handlingvacuum module 6130, and may selectively transport items such as wafersor other workpieces to a process module 2002 for processing. Thetransport cart 6140 can be realized in many embodiments, including amagnetically levitated and/or driven cart, a cart on a railway, a cartwith an arm or extending member, a cart on wheels, a cart propelled by atelescoping member, a cart propelled by an electric motor, a cart thatis capable of tipping or tilting, a cart that may traverse a slopingtunnel to move a work piece or work pieces from one height to another,an inverted cart suspended from a transport track, a cart that performsprocessing or one of several functions on a work piece during transport,or the like.

The cart 6140 may be on gimbals, or suspended as a gondola, toaccommodate variations in horizontal alignment of the path of the cart6140. Similarly, the cart may include a wafer holder (e.g., supports,shelves, grippers, or the like) that is on gimbals, or that is suspendedfrom a wire or the like, such that the wafer holder maintains asubstantially level orientation while the cart traverses an incline.Thus, in certain embodiments, the cart may traverse inclines, declines,or direct vertical paths while maintaining a wafer or other workpiece insubstantially uniform, level horizontal alignment. Such a cart may havea selectively fixed horizontal alignment so that movements such asacceleration or deceleration in a horizontal plane do not cause tippingof the workpiece. In other embodiments, the cart may be permitted to tipduring acceleration or deceleration in order to stabilize a position ofthe work piece on the cart 6140.

The cart 6140 may be made of materials suitable for use in vacuum, suchas materials that mitigate generation of undesirable particles ormaterials that have low outgassing characteristics. In an embodiment,the cart 6140 is a simple cart, without a robotic arm. As a significantadvantage, using an armless cart mechanically simplifies the cart, thussaving on maintenance, repairs, and physical contamination of vacuumenvironments. In such embodiments, each entrance/egress from the cartpath preferably includes a robot or similar device to place and retrieveworkpieces on the cart.

In order to distinguish between various possible implementations, thefollowing description employs the term “passive cart” to denote a cartwithout a robotic arm or other mechanism for loading and unloadingwafers. As noted above, this configuration provides a number ofadvantages in terms of simplicity of design and in-vacuumimplementation, and provides the additional advantage of mitigating thecreation of contaminants from mechanical activity. The term “activecart” is employed herein to denote a cart that includes a robotic arm.Active carts present different advantages, in particular the improvedversatility of having a robotic arm available arm at all times with thecart and a relaxation of the corresponding requirement for waferhandling hardware at each port 6180 of the tunnel 6150. It will beunderstood that, while providing a useful vocabulary for distinguishingbetween carts with and without robots, a so-called “passive cart” maynonetheless have other mechanical or active components such as wheels,sensors, and so forth.

The cart 6140 may include space for a single wafer or the like. In someembodiments, the cart 6140 may include a plurality of shelves so thatmultiple wafers can be transported by the cart. The shelves may have acontrollable height or the like in order to accommodate access todifferent ones of the wafers by a fixed-height robot, or the shelves mayhave a fixed height for use with robotic handlers having z-axis control.In still other embodiments, the cart 6104 may include a single surfacehaving room for multiple wafers. While multi-wafer variations require anadditional degree of processing control (to account for multiplepossible positions of a wafer on each cart), they also provide increasedflexibility and capacity to the systems described herein. In otherembodiments, the cart 6140 may be adapted to carry a multi-wafer carrieror for concurrent handling and/or processing of multiple wafers.

The cart 6140 may provide supplemental functionality. For example, thecart 6140 may include a wafer cooling or heating system that controlswafer temperature during transport. The cart 6104 may also, or instead,include wafer center finding sensors, wafer metrology sensors, and thelike. It will be appreciated that, while a range of possiblesupplemental functions may be supported by the cart 6104, thosefunctions that employ solid state sensing and processing may bepreferably employed to facilitate preservation of a clean processingenvironment.

The tunnel 6150 may be of any cross-sectional shape and size suitablefor accommodating the transport cart 6140 and any associated payload. Ingeneral, the tunnel 6150 will be capable of maintaining an environmentsimilar or identical to various process cells connected thereto, such asa vacuum. The vacuum environment may be achieved, for example byproviding slot valves or the like for independent vacuum isolation ofeach port 6180 (generally indicated in FIG. 61 as coextensive with slotvalves 6180, although it will be understood that the slot valveidentifies the mechanism by which seals are opened and closed, while theport refers to the opening through which wafers and the like may bepassed). While a slot valve or slit valve is one common form ofisolation device, many others are known and may be suitable employedwith the systems described herein. Thus it will be understood that termssuch as slot valve, slit valve isolation valve, isolation mechanism, andthe like should be construed broadly to refer to any device orcombination of devices suitable for isolating various chambers, processmodules, buffers, and so forth within a vacuum environment, unless anarrower meaning is explicitly provided or otherwise clear from thecontext.

In some embodiments, the tunnel 6150 may maintain an intermediateenvironment where, for example, different process cells employ differentvacuum levels, or include other gasses associated with processing. Whiledepicted as a straight line, the tunnel 6150 may include angles, curves,and other variations in path suitable for accommodating travel of thetransport cart 6140. In addition, the tunnel 6150 may include tracks orother surfaces consistent with the propulsion system used to drive thetransport cart 6140 from location to location. In some embodiments, thetunnel 6150 may include inclines or other variations that accommodatechanges in height among various process cells connected thereto. Allsuch variations that can be used with a cart 6140 to move wafers orother workpieces within a processing environment are intended to fallwithin the scope of this disclosure.

FIG. 62 shows another embodiment of a wafer processing system includinga transport system. As shown, the system 6100 may include a plurality oftransfer robots and process modules capable of simultaneously handlingand/or processing a plurality of wafers. The system 6100 may alsoinclude a controller such as computing facility (not shown)interconnected with the transport and processing system members toschedule motion of the cart 6140 according to various processes withinthe system 6100. Processing of each work piece may be controlled so thattransport cart 6140 position and availability is coordinated with startand stop times of the processes within a number of process cells 6170.The process cells 6170 may be identical or different. In variousembodiments, the system 6100 may perform serial processing, parallelprocessing, or combinations of these to process a plurality of workpieces at one time, thereby improving utilization of the processingresources within the process cells 6170.

FIG. 63 shows another embodiment of a semiconductor processing facilityincluding a wafer transport system. As depicted in FIG. 63, processcells 6170 may be connected to both sides of a transport tunnel 6150.Numerous variations in work piece processing, such as those depicted inFIGS. 61-62 above, may be employed in combination with the configurationof FIG. 63. As illustrated by these figures, any number of process cells6170 in a variety of configurations, may be readily accommodated by atransport cart 6140 interconnecting process cells 6170. This includesgreater numbers of processing cells 6170, as well as curved, angled,multi-lane, and other cart paths. For example, cells on one side of acart path may mirror process cells on the right side, to provide dualthree-step process groups having a common tunnel 6150, transport cart6140, transfer robot 6130, exchange zone 6120 and interface module 6110.

FIG. 64 illustrates a configuration that uses a work piece handlingvacuum module 6131 and a plurality of process modules 2002 arranged as acluster tool 6410. This layout offers the compact footprint andfunctionality of a cluster tool, along with a cart-based transportsystem that can be flexibly interconnected to any number of additionalprocess cells.

FIG. 65 shows another embodiment of a semiconductor processing facilityincluding a transport system. In this system, a number of cluster tools6410 are interconnected using a transport cart 6140 and tunnel 6150 asdescribed generally above. It will be noted that this arrangementpermits interconnection of any number of cluster tools regardless ofsize. As a significant advantage, this reduces the need for a densegroup of cluster tools arranged around a single or multi-robot handlingsystem.

FIG. 66 shows another embodiment of a semiconductor manufacturingfacility using a wafer transport system. In this embodiment, a linearprocessing system 6610 is constructed with a plurality of processmodules 2002A-2002D functionally interconnected through a number ofrobots 6131, 6632, 6633 that employ robot-to-robot hand offs for waferhandling within the linear system 6610. This linear system 6610 mayinclude an interface to a transport cart 6140 which may move wafers toand from the linear system 6610 and any other process cells 6170connected to the transport system. It will be understood that, while inthe depicted embodiment, each transfer robot services two processmodules 2002 and handles transfer of work pieces to another transferrobot, other linear layouts may also be employed.

In operation, work pieces may move into the linear process cell bymanipulation with the transfer robot 6131 from transport cart 6140. Thetransfer robot 6131 may either transfer the work piece to transfer robot6632 or to one of two process modules 2002A or 2002B. The transfer robot6632 may receive a work piece to be processed from the transfer robot6631 and either transfers it to the transfer robot 6633 or to one of twoprocess modules 2002 e or 2002D. The transfer robot 6633 may receive awork piece to be processed from the transfer robot 6632. Finished workpieces may be transferred to consecutive, adjacent transfer robots untilpassing through the transfer robot 6131 onto tunnel transport cart 6140.In one embodiment, a load lock may be provided at one end of the linearsystem 6610 to permit the addition or removal of wafers at an opposingend of the linear system 6610 from the transport cart interface.

FIG. 67 shows a semiconductor fabrication facility including a transportsystem. As shown in FIG. 67, a number of linear systems 6610 may beinterconnected using a transport cart 6140 and tunnel 6150. As asignificant advantage, a single vacuum environment for a number ofdifferent linear systems 6610 may be interconnected regardless of thelayout and physical dimensions of each linear system 6610. Additionally,longer sequences of processing, or increased throughput of work piecesfor individual process cells, can readily be achieved using the cart andtunnel systems described herein.

In one aspect, the selection of process cells connected to the tunnel6150 may be advantageously made to balance or control system-widethroughput. Thus, for example, process cells with relatively quickprocess times can be combined with a suitable number of parallel processcells providing a different process with a slower process time. In thismanner, a process cell with quick process time can be more fullyutilized by servicing multiple downstream or upstream process cellswithin a single vacuum environment. More generally, using the transportcart 6140 and tunnel 6150, or a number of such carts and tunnels,greater design flexibility is provided for fabrication process layoutsto balance load and/or improve utilization among process cells withvarying process times and throughput limitations.

FIG. 68 shows a semiconductor fabrication facility with a transportsystem. As shown, a fabrication facility may include a variety ofdifferent tool and module types. For example, the facility may includeplurality of cluster process cells 6410 and a plurality of linearprocess cells 6610, along with a storage cell 6820 that provides amulti-wafer buffer for temporary in-vacuum storage of work pieces. Asfurther depicted, the system may include more than one front end moduleusing, for example, two front end modules on opposing ends of a tunnel6150. As will be clear from the following description, other shapes arepossible, and may include T-junctions, V-junctions, X-junctions, or anyother type of interconnections, any or all of which may end at a frontend module or connect to one or more additional tunnels 6150. In thismanner, large, complex layouts of interconnected processing modules maybe more readily implemented. It will be further understood thatindividual process cells may be added or removed from such a system inorder to adapt a processing facility to different process requirements.Thus, a modular and flexible fabrication layout system may be achieved.

FIG. 69 shows a semiconductor fabrication facility with a transportsystem. In the embodiment of FIG. 69, an isolation valve 6180 isprovided within a straight length of vacuum tunnel 6150. The isolationvalve 6180 permits isolation of portions of the tunnel 6150, and moreparticularly allows processes in which different vacuum environments areappropriate for different groups of process cells. In this embodiment, asecond transport cart 6940 is included so that each half of the tunnel6150 includes an independent transportation vehicle while the isolationvalve 6180 is closed. It will be understood that, in certain processes,the isolation valve may remain open and both carts may service bothhalves of the tunnel 6150. More generally, this illustrates theflexibility of the transportation system to accommodate complexprocesses using a variety of different processing tools. As depicted inFIG. 69, the system may also include a work piece storage elevator 6920to provide storage for a plurality of work pieces.

Referring to FIG. 70, cluster and linear processing groups may becombined with a plurality of tunnel transport cart systems to provide acomplex process group. In the embodiment of FIG. 70, two clusterprocessing cells, a first cluster processing cell 7010 at a first end ofthe processing group, and a second cluster processing cell 7011 at asecond end of the processing group, each interconnect with tunneltransport cart 6140, 6140A for transporting work pieces among theprocess cells. As depicted, the linear processing cell 7050 may includean access port on each end.

In the embodiment of FIG. 70, an example work piece flow may includereceiving the work piece in first cluster processing cell 7010 frominput interface module 6110, processing the work piece as necessary inthe cluster cell 7010. The first tunnel transport cart 6140 may thentransport the work piece to a linear processing group 7050 where it isreceived by the work piece handling vacuum module 6130 and processed, asrequired, in one or more process modules 2002. Within the linearprocessing group 7050 the work piece may be transferred between adjacenttransfer robots until all processing within the linear processing group7050 is complete for the work piece, at which time the work piece istransferred to a second tunnel transport cart 6140A for transport to asecond cluster processing cell 7011. Further processing of the workpiece, as required, may be performed in the second cluster processingcell 7011 and received into an exit interface module 7020 for automatedor manual retrieval.

It will be appreciated that the system may handle multiple wafers at onetime. In some embodiments, wafers may flow uniformly from one entrance(e.g., a first front end module 7020) to one exit (e.g., a second frontend module 6110). However, the depicted layout can readily accommodatewafers simultaneously traveling in the opposing direction, or wafersentering and exiting through a single one of the front end modules, orcombinations of these. As noted above, this permits the deployment offabrication facilities that significantly improve utilization ofparticular processing tools, and permits the implementation of numerous,different processes within a single fabrication system.

FIG. 71 shows a two-ended tunnel 7110 having an L-shape. FIG. 72 shows athree-ended tunnel 7210 having a T-shape. FIG. 73 shows a two-endedtunnel 7130 having a V-shape. It will be understood that tunnels may useany of these shapes, as well as other shapes, and combinations thereofin order to accommodate design factors ranging from floor space within afacility to the shape and size of individual pieces of equipment. Asdepicted by these figures, a variety of different process cell types maybe connected to a tunnel as appropriate to a particular process.

Referring to FIG. 74, a transport cart 6140 may interconnect systemshaving different processing times. For example, the transport cart 6140may connect a preclean process 6130 to a system 7410 with relativelylong process times such as Chemical Vapor Deposition (“CVD”) and asystem 7420 with relatively short process times such as Physical VaporDeposition (“PVD”).

For configurations that include process steps of substantially differentdurations, slower processes 7410 may be supported by a relatively largenumber of associated tools (which may be deployed as clusters or lineargroups) in order to balance throughput for the combined processingsystem 7400. Thus, using the transport systems described herein,conceptual bottlenecks in complex semiconductor manufacturing processescan be addressed by simply expanding capacity around longer processes,thereby improving utilization of tools having relatively shorterprocesses. By way of example and not of limitation, processes havingrelative durations of 1 (preclean): 2 (PVD): 10 (CVD) can be supportedby a facility having 2 preclean tools, 20 CVD processing tools, and 4PVD processing tools working together in a single vacuum environmentsupported by a cart 6140 and tunnel 6150. While preserving this ratio,the total number of each tool type may be expanded or contractedaccording to further process constraints such as the throughput capacityof front end modules or other separate systems within a fabricationfacility.

Referring to FIG. 75, the configuration of FIG. 74 alternatively mayinclude a plurality of carts 6140 in one tunnel 6150 wherein each carttransports work pieces over a portion of the tunnel 6150. Coordinationof the carts may be employed to avoid collision of adjacent carts at acommon side process cell.

An alternate embodiment may include a tunnel configured as a loop toallow transport carts that have reached the end process cell to continuein a loop to an input interface module to accept a new work piece fortransport. The loop may be configured either as a horizontal loop or avertical loop, or a combination of these.

Referring to FIG. 76, a plurality of tunnel transport carts may beinterconnected by work piece handling vacuum modules. In the embodimentof FIG. 76, a transfer robot 6 p 0 may serve as an interface between twoseparate tunnel transport carts 6140 and 6140A, and may further serve asan interface to a front end module 6110 for purposes of transferringwork pieces into and out of the vacuum environment. The embodiment ofFIG. 76 may accommodate substantial flexibility of use of the processcells. Each interface module may enable access to both of the tunneltransport carts, facilitating increased capacity if the process cellsassociated with each tunnel are the same. Alternatively, the embodimentof FIG. 76 may allow redundancy of processes; a common interface modulefor different processes, or may support additional processing steps bycombining the separate tunnel transport cart systems into one processgroup.

FIG. 77 shows a system 6100 wherein the transport system forms acomplete loop 7710. In this embodiment, a transport cart 6140 may movecontinuously in a single direction around the loop, while adding orremoving work pieces at appropriate locations within the process. Inaddition, one or more locations may be serviced by an equipment frontend module for transferring work pieces to and from the vacuumenvironment. As a significant advantage, this layout permits directtransfer between any two process cells connected to the system. It willbe understood that any number of transport carts 6140 may share thetunnel, and having more than one transport cart 6140 increasesprocessing options by permitting multiple inter-cell transfers at asingle time.

FIG. 78 shows a semiconductor processing system including atransportation system. The system 7800 is a complex system including avariety of cart and processing module configurations. In particular, thesystem 7800 of FIG. 78 includes four front end modules, one storagemodule, four independent cart transport systems, and six separate linearprocessing modules. By way of illustration, it will be noted that one ofthe linear processing modules 6110 includes two front end modules (oneon each end), and intersects two tunnels for interconnection to adjacentprocessing systems. More generally, and as generally noted above, anyarrangement of tools, clusters, and related hardware can be shared usingone or more tunnels and carts as described herein. The embodiment ofFIG. 78 may allow work pieces to be removed from the vacuum environmentat a number of locations (illustrated as front end modules) to undergoatmospheric processes such as inspection, chemical mechanical polishing,or electroplating. Work pieces may also be returned to the vacuumenvironment as needed. A wide variation of possibilities emerges fromthis type of system.

In the configuration of FIG. 78, transfer robots 6130 may be used totransfer work pieces from a transport cart 6140 to a process cell 6170,or an interface module 6110, as well as transferring work pieces betweencarts 6140 on separate transport vacuum tunnels 6150.

This configuration permits a work piece to be processed on one or moreof the processes associated with one or more of the transport vacuumtunnels without the work piece having to be removed from the vacuumenvironment. Linking transport vacuum tunnels by transfer robots allowsfor isolation of one or more of the transport vacuum tunnels, thuspermitting adjacent use of different vacuum environments and enablingindependent operation of the processes associated with each of thetransport vacuum tunnels.

FIG. 79 shows an embodiment which includes vacuum tubes 7910 locatedbetween processing modules. More generally, these vacuum tubes 7910 maybe placed between any adjacent vacuum hardware to extend a vacuumenvironment across a physical void. The vacuum tubes 7910 may befashioned of any suitable material including, where interior visibilityis desired, glass or the like. These vacuum tubes 7910 can be intendedto provide additional functionality such as described in previousparagraphs and below, and have very few design constraints except thatthey preferably form a vacuum seal where they physically connect toother system components, and they provide sufficient interior space forpassage of wafers, workpieces, and any robotic arms or the likeassociated with handling same. In general, the vacuum tubes 7910 serveas a physical buffer between adjacent hardware, such as processingmodules (or, as depicted, pairs of modules serviced by a single robot)in order to permit functional couplings that cannot be achieved directlydue to physical dimensions of the hardware.

FIG. 80 shows a semiconductor processing system including atransportation system. The embodiment of FIG. 80 includes dualside-by-side independent transport carts in a single vacuum tunnel.Carts 6140 and 6140A may operate independently on non-interfering paths8010 and 8011 within the tunnel 6150. Robots 6130 may transfer a workpiece among a first cart 6140, a second cart 6140A, and an interface6110. In one embodiment, the robots 8030 that service one or more of theprocess cells may be configured to reach across the tunnel 6150 so thatworkpieces may be picked from or placed to either of the carts 6140A,6140B. A number of work piece handling vacuum modules may move workpieces between the carts 6140, 6140A and their respective process cells.The embodiment of FIG. 80 allows for faster transfer of work piecesamong process cells than would an embodiment with dual coordinatedtransport carts or a single path. In another aspect, the paths 8010,8011 may include exchanges or cross-overs to permit each cart 6140,6140A to switch between the paths 8010, 8011 for increased flexibilityin material handling. One or more isolation valves may be provided toisolate various segments of the tunnel 6150.

FIG. 81 shows a side view of dual vertically opposed independenttransport carts in a vacuum tunnel. In the embodiment of FIG. 81, atunnel 6150 encloses two transport carts 6140 running on railway orlevitation systems 8130. A robot 6130 may access work pieces through anisolation valve 6180 for loading and unloading the work pieces among aninterface 7410 (such as a load-lock or equipment front end module) andthe transport carts 8110. In a similar way, transfer robots (not shown)may transfer work pieces among carts 8110 and process cells 8120. Thetransfer robot 6130 may be vertically adjustable through use of a robotlift 8140 or other z-axis controller to facilitate transferring a workpiece between different cart levels.

FIG. 82 shows an embodiment of transport cart with a robotic arm in aprocessing system that also includes transfer robots for work piecehandling. Transfer robots 6130 and 6130A may coordinate with a cartrobot 8210 to facilitate handling of work pieces. One or more vacuumextensions 7910 may be provided to physically accommodate adjacentprocess cells.

FIG. 83 illustrates a semiconductor manufacturing system with dualindependent transport tunnels 6150. Each tunnel may include a transportcart 6140. In the embodiment of FIG. 83, a transfer robot 8310 withvertical motion capabilities may transfer work pieces among thetransport cart in the lower tunnel, the transport cart in the uppertunnel, and a load-lock 1410. Similarly, transfer robots (not shown) maytransfer work pieces among the upper cart 6140, the lower cart 6140 andthe process cells 8120.

FIG. 84 is an alternate embodiment of the embodiment depicted in FIG. 83wherein a work piece elevator 8410 is used to move a work piece from thelower tunnel to the upper tunnel. Additionally, a transfer robot 6130may be associated with each tunnel 6150 to transfer the work piecebetween the work piece elevator 8410 and the transport cart 6140.Additionally a transfer cart 6130 may be required between the work pieceelevator 8410 and the load-lock 1410 to facilitate transfer of workpieces between the work piece elevator 8410 and the load-lock 1410.

FIG. 85 shows an embodiment of a tunnel system using frog-leg typerobots. The frog-leg type robot may be the main work piece handlingtransfer robot. The transfer robot 8510 may be used to transfer workpieces from the interface 6110 to the cart 6140, and is depicted as afully retracted frog-leg robot. The transfer robot 8520 may also beretracted and is shown in a cluster cell configuration on the right sideof tunnel 6150. Additional robots within the system may be frog-legrobots, as illustrated generally in the linear processing arrangement onthe left side of the tunnel 6150. In the linear processing group, thetransfer robot 8530 may extend into a process chamber, while transferthe robot 8540 extends toward the transfer robot 8550, which is depictedas a dual frog-leg robot partially extended toward both associatedprocess chambers simultaneously.

FIG. 86 illustrates an embodiment of an integration scheme of a“bucket-brigade” 8610 linear group, a wafer transport shuttle system8620 and traditional cluster tool systems 8630. More generally, anycombination of traditional cluster tools 8630, linear “bucket-brigade”systems 8610 and shuttle systems 8620 is possible. In one application,short processes on the cluster tool can be combined with longerprocesses in the bucket brigade to improve per-tool utilization withinthe system.

While numerous arrangements of semiconductor handling and processinghardware have been described, it will be understood that numerous othervariations are possible to reduce floor space usage and shorten thedistance between related processing groups. For example, vacuumtransport systems may be usefully deployed underneath floors, behindwalls, on overhead rails, or in other locations to improve the layout offabrication facilities, such as by clearing floor space for foot trafficor additional machinery. In general, these embodiments may employvertical lifts in combination with robotic arms and other handlingequipment when loading or transferring wafers or other work pieces amongprocessing modules. FIG. 87 depicts such a system including a verticallift.

FIG. 87 shows a typical loading/unloading system for use in waferfabrication. An overhead track 8702 may deliver a cart 8704 with workpieces, to a wafer Front Opening Unified Pod (FOUP) which may include aload point 8708 and an equipment front end module (EFEM) 8710. A loadlock 14010 may be employed to transfer wafers from the FOUP 8708 to oneor more processing modules using, for example, the work piece handlingvacuum module 6130 depicted in FIG. 87. A plurality of work piecehandling vacuum modules supported by pedestals 10110 with interveningvacuum modules 4010 may be configured as a semiconductor vacuumprocessing system. Work pieces may be transferred in a cassette 8718that the cart 8704 may lower to the FOUP 8708 using an elevator orvertical extension 8720.

FIG. 88 illustrates an improved wafer handling facility in which atransport cart 6140 in a vacuum tunnel 6150 is installed beneath afactory floor. A vertical lift 8810 may be employed to move wafers, or acassette carrying one or more wafers to the processing level. It will beunderstood that, while a single cart 6140 in a single tunnel 6150 isdepicted, any number of tunnels 6150 and/or carts 6140 may intersect ata lifter 8810 that transfers wafers to a bottom access load lock 14010.

FIG. 89 illustrates an embodiment of an overhead cart 6140 and vacuumtunnel system 6150. This system may be used with any of the layoutsdescribed above. The configuration depicted in FIG. 89 facilitatestransferring a cart 6140 carrying one or more wafers from a tunnel 6150to a load lock 14010. However, in general, the lifter 8810 may beemployed to move wafers and/or carts from a top access load lock (whichis at a processing level) to an overhead vacuum tunnel 6150 where a cart6140 can transport the work pieces along a transport system, such as arail system. In one embodiment, drive elements of the lifter (not shown)may be installed below the processing level (e.g. on a floor or beneatha floor), or above the processing level. Deploying the mechanicalaspects of the lifter below the processing level may advantageouslyreduce the number and/or size of particles that may fall on wafers beingcarried by the lifter.

FIG. 90 depicts a semiconductor vacuum processing system including twoprocessing groups, such as a linear processing groups interconnected bya beneath processing-level tunnel 6150. The tunnel 6150, which mayinclude any of the vacuum tunnel systems described above, may bedeployed, for example, beneath a factory floor. The tunnel 6150 mayconnect groups of processing modules separated by large distances, andmay improve the handling capabilities of the interconnected system byproviding, e.g., storage areas, switches, sorting systems, and so forth.Processing groups may include process chambers, load locks, work piecehandling vacuum modules 6130, vacuum modules 4010: multifunctionmodules, bypass thermal adjustment modules, lithography, metrology,mid-entry load locks, vacuum tunnels extensions for extending the reachof a vacuum system, and a wide variety of semiconductor processingrelated functions. Processing groups may also include modules supportedby-a pedestal. One or more processing groups, including the tunnel 6150and cart 6140 may be controlled by a controller, such as a computingfacility executing a software program

FIG. 91 depicts two processing groups interconnected by an overheadtunnel network. The tunnel network 9102, which may include any of thevacuum tunnel systems described above, may be deployed, for example, ona second floor above a factory floor or suspended from a factoryceiling. The tunnel network 9102 may connect groups of processingmodules separated by large distances, and may improve the handlingcapabilities of the interconnected system by providing, e.g., storageareas, switches, sorting systems, and so forth.

FIG. 92 shows a system for sharing metrology or lithography hardware. Asillustrated, the tunnel network and other module interconnection systemsdescribed herein may incorporate, e.g., shared metrology or lithographyresources 9205 wherein the vacuum based cart system removes and returnsa sample wafer from a flow. Generally wafers “flow” from one equipmentfront end module 9203 or other atmospheric interface entrance station toanother equipment front end module 9204. If an in-process inspection isdesirable to check for certain process parameters, such an inspectioncould be performed in a location such as an inter-module buffer 9207. Inthe present system there are several such interim locations where suchan inspection could be performed. However, some measurement systems canbe physically quite large and can be difficult to accommodate in moduleinterconnections such as the inter-module buffer 9207 because of theirsize.

In such a situation it may be desirable to provide a vacuum cart andtunnel system as generally disclosed herein to remove one or more wafersfrom the flow under vacuum to a standalone metrology or lithographysystem 9205. A cart 9208 may be positioned in the flow at a location9201 between process modules to receive a wafer. It will be understoodthat, while a particular location is identified in FIG. 92 as thelocation 9201, any number of locations within the system 9200 may besimilarly employed according to desired process flows, capabilities,physical space constraints, and so forth. Software or setup logic maydetermine which wafer to remove from the flow at 9201. In otherembodiments, the cart may dock with a module 9202 within the system9200, where a wafer handling robot may load a wafer on the cart fortransport to the metrology or lithography system 9205.

As depicted in FIG. 92, a metrology or lithography system 9205 may beshared by more than one work piece processing system. In an example, awafer originating from the first loading system 9203 may be assessed ina metrology system 9205 that can also be accessed by wafers originatingfrom a second system 9206. While two linear systems are depicted, itwill be understood that other arrangements of processing modules maysimilarly employ shared resources such as metrology or lithographysystems according to the general principles described with reference toFIG. 92. For example, using a variety of rail configurations with, forexample, curves, switches, and so forth, the system may be configured toconcentrate metrology or lithography systems and/or other sharedresources for any number of processing systems in a common location.Such a system could apply metrology or lithography to wafers frommultiple locations and multiple systems. As described above with respectto processes having different process times, a single metrology orlithography system may be shared among numerous process cells or systemto achieve high utilization of metrology or lithography resources in asemiconductor manufacturing system.

As noted above, the cart and work piece handling vacuum module systemsdescribed herein may be combined with simple vacuum tube extensions thatmay be disposed in-line with, or adjacent to work piece handling vacuummodules 6130 to facilitate greater levels of flexibility in thearrangement and interconnection of different processing hardware.Referring to FIG. 93, a semiconductor work piece processing system mayinclude a cart, a tunnel, an EFEM, a plurality of work piece handlingvacuum modules, various process chambers, and a vacuum extension tunnel9304.

In addition one or more link modules 9302, 9308 may be provided tointerconnect any of the above hardware. In addition to accommodatinghardware spacing (in the same manner as vacuum extensions), a module9302, 9308 may provide a variety of supplemental functions associatedwith a semiconductor processing system. For example, a link module 9308may provide storage, operating as a buffer in a wafer process flow. Alink module 9302 may provide metrology, measurement, or testing ofwafers. A link module 9308 may provide operator access to a work piece,in which case the link module 9308 may include an isolation valve andvacuum pump. A link module 9302, 9308 may provide thermal management,such as by cooling or heating a wafer between processes. A link modulemay provide buffering and/or aligning capacity for single and/ormultiple wafers such as provided by the buffering aligner apparatus 9700described below. With respect to the buffering aligner, it will beunderstood that this use in a link module is an example only, and that abuffering alignment module may also or instead be usefully employed atother points in a process, such as in an equipment front end module. Forexample, if process chambers process wafers in mini-batches of 2, 3, 4or 5 or more wafers, then it may be efficient to employ a bufferingsystem at an aligner to prevent the alignment time from becoming abottleneck in a larger process. Once the proper number of wafers hasbeen prepared in the buffer of an EFEM, an atmospheric robot can affecta batch transfer of these (aligned) wafers to a load lock.

A link module may provide bypass capabilities, permitting two or morewafers to cross paths between process modules. More generally, a linkmodule 9302, 9308 may provide any function that can be usefullyperformed in a vacuum environment between processing tools, includingany of those identified above as well as combinations of same.

As a significant advantage, such multi-function link modules can reducethe need for additional processing modules, and reduce wait timesbetween processing modules in a variety of ways. For example, bypasscapabilities alleviate the need to complete remove one wafer from acluster or linear processing module before adding another, sinceconflicting paths can be resolved within the bypass module. As anotherexample, the 11J1al management within link modules can reduce the needto wait for heating or cooling once a wafer reaches a particular tool.Other advantages will be apparent to one of ordinary skill in the art.

More generally, using the systems and methods described herein, aworkpiece may be processed during transport and/or wait time betweenprocess tools. This may include processing in a link module 9302, 9308as described above, as well as processing on a transport cart 6150,processing in a tunnel 6150, processing in a buffer, processing in aload lock, or processing at any other point during wafer handlingbetween process tools.

FIG. 94 shows a thermal bypass adjusting vacuum module. It is frequentlydesirable to heat or cool work pieces between process steps of asemiconductor manufacturing process. It may also be desirable tosimultaneously allow other work pieces to pass by the work piece beingheated or cooled. Since cooling or heating a work piece may takeapproximately 20 to 60 or more seconds, it is also advantageous tofacilitate transfer of other work pieces so that the cooling or heatingdoes not block work piece flow. A vacuum module in which work pieces canbe exchanged between robots while facilitating temperature adjustment ofanother work may also allow temporary storage of work pieces.

Such a vacuum module may include an environmentally sealable enclosureto capture and thermally adjust a work piece in transition before thework piece is transferred to the next process step, while allowingcoordinated pass through of other work pieces during the heating orcooling process.

It may be advantageous to include such a vacuum module in closeproximity to a process chamber in a vacuum semiconductor processingsystem, such that a work piece may be heated or cooled to meet theparticular needs of the process chamber for improved processing.Additionally, including and utilizing such a vacuum module canfacilitate effective use of process chambers in the system by allowing asecond work piece to be brought up to temperature as a first work pieceis being processed.

Additionally, a work piece may be returned to ambient temperatureimmediately after it is taken from a process chamber, before it ishandled by additional transfer robots, thereby eliminating any waitingtime while the work piece cools before transferring another work pieceto the process chamber.

It may also be beneficial to include a bypass thermal adjuster incombination with cart/tunnel systems in a semiconductor processingsystem to further facilitate flexibility, utility, process efficiency,and the like. Disclosed in this specification are examples of beneficialconfigurations of the bypass thermal adjuster in combination withworkpiece handling vacuum modules, carts 6140, tunnels 6150, and otherprocess and function modules.

Referring to FIG. 94, an end effector of a work piece handling vacuummodule 6130 is transferring a work piece into a thermal adjustmentbuffet module 9402 for purposes of thermally adjusting the work piece.

FIG. 94 further shows a work piece handling vacuum module 6103 placingthe work piece on support clips 9404 which are mounted to an upperinterior surface of a moveable enclosure, and may include fingers or thelike to support the edges of a work piece centered within the enclosure.The moveable enclosure consists of two portions, an enclosure bottom9410 and an enclosure top 9412. When the enclosure top 9412 is loweredinto contact with the bottom 9410, a work piece supported by supportclips 9404 is fully isolated from the environment outside enclosure9408. The bypass thermal adjuster 9402 also facilitates transferring asecond work piece through the module when the moveable enclosure isclosed.

Various embodiments of tunnel and cart systems have been describedabove, as well as other linking hardware such as vacuum extensions andlinking modules. In general, these systems support modular use and reuseof semiconductor processing tools from different vendors, and havingdifferent processing times and other characteristics. In one aspect,such systems may be further improved through variations such asdifferent tunnel shapes (curvilinear, L, U, S, and/or T shaped tunnels)and shapes supporting two, three, four, or more equipment front endmodules. In another aspect, additional hardware may be employed toprovide further flexibility in the design and use of semiconductormanufacturing systems. The following description identifies a number ofadditional components suitable for use with the systems describedherein.

Referring to FIG. 95, a semiconductor work piece handling robot 6130 mayconnect through a vacuum port to a configurable vacuum module 9502. Theconfigurable vacuum module 9502 may include ports 9504 for utilitiessuch as gas, water, air, and electricity used during processing.

The configurable vacuum module 9502 may include a removable bottom platewhich may include a work piece heater for preheating a work piece beforethe handling robot 6130 transfers the work piece into an attachedprocessing module.

The configurable vacuum module 9502 may include storage for a pluralityof work pieces. As an example, work pieces may be placed by the handlingrobot 6130 on a rotating platform within the configurable vacuum module9502. The maximum number of work pieces may be determined by the size ofeach work piece and the size of the rotating platform. Alternatively theconfigurable vacuum module 9502 may include a surface adapted to supportsemiconductor work pieces, with the surface sufficiently large to allowa plurality of work pieces to be placed on the surface in anon-overlapping arrangement. The storage within the configurable vacuummodule 9502 may be enabled by a work piece elevator with a plurality ofwork piece support shelves, wherein the elevator can be controlled toadjust height for selection of a particular shelf to be accessed by thehandling robot 6130.

The configurable vacuum module 9502 may include metrology devices forpurposes of collecting metrics about the work piece. As an example, ametrology device such as an optical sensor, can be used to detect thepresence of a work piece in the configurable vacuum module 9502 andinitiate an automated inspection of the work piece by a machine visionsystem. Such metrics are useful to maintain and improve control andquality of the fabrication processes being performed on the work piecein associated process modules.

The configurable vacuum module 9502 may further include interface ports9504 capable of supporting ultra high vacuum operation. The ultra highvacuum may be achieved by configurable vacuum module 9502 wherein theconfigurable vacuum module 9502 is constructed with materials such asstainless steel known to support an ultra high vacuum environment. Suchan environment may be useful for removing trace gasses in theenvironment and reducing the introduction of gasses caused by outgassingof materials in the environment.

The configurable vacuum module 9502 may provide a load lock function forthe vacuum processing environment. Such a function may be useful in workpiece exchange between a user ambient environment and the vacuumprocessing environment by allowing work pieces supplied by a user to beintroduced into the vacuum environment by sealing the work pieces in theconfigurable vacuum module 9502 and generating a vacuum environmentaround the sealed work pieces.

The configurable vacuum module 9502 may support fabrication processingof a work piece such as rapid thermal anneal or in-situ wafer cleaning.Rapid thermal anneal may be beneficial in a semiconductor vacuumprocessing environment for achieving specific changes in a semiconductorwork piece such as activating dopants, and densifying deposited films.In-site wafer cleaning can be needed to remove residue or particlesdeposited during processing in the chambers from the wafer surfaces oredges.

The configurable vacuum module 9502 may also include combinations of anyof the above, as well as any other capabilities suitable for use betweenprocessing tools in a semiconductor manufacturing environment.

In general, it is expected that the configurable vacuum module 9502 maybe configured at a fabrication site through the addition or removal ofhardware associated with desired functions. Thus, for example,temperature sensors and a heating element may be removed, and replacedwith multiple shelves for wafer storage. Other aspects, such asconstruction from materials appropriate for high vacuum, may beimplemented during manufacture of the module 9502. In general, aconfigurable vacuum module 9502 as described herein is characterized bythe removability/replaceability of module hardware, or by an adaptationto a particular process using a combination of hardware that providesmultiple capabilities (e.g., heating, cooling, aligning, temperaturesensing, cleaning, metrology, annealing, scanning, identifying, moving,storing, and so forth).

The functions described above may also be implemented directly withinthe cart and tunnel systems described above, either as link moduleswithin a tunnel, or in association with a cart or tunnel, to providevarious processing functions during transportation of a wafer. Asdescribed herein, combining work piece handling vacuum modules andcarts/tunnels provides greater flexibility to a semiconductor processingsystem by facilitating the interconnection of local processing groupsthat are separated by a large distance, and by facilitating theinterconnection of large processing systems that are in close proximity.Combining a multifunction module 9502 with a cart/tunnel system canfacilitate the productive use of transport time to achieve more rapidwafer processing.

Referring to FIG. 96 a vacuum extension tunnel 9602 is described ingreater detail. The vacuum extension tunnel 9602, also referred toherein as a vacuum tube or vacuum extension, can be used in a variety ofpositions in a semiconductor vacuum processing system to provide acontinuous vacuum connection between vacuum modules. Vacuum extensiontunnel 9602 may have a substantially rectangular shape, with interfaceports on one or more sides. Each interface port may provide a vacuumsealable industry standard interface for connection to a variety ofvacuum modules. In embodiments, an isolation valve 4006 may be connectedto each interface port to provide a means of ensuring vacuum isolationbetween vacuum extension tunnel 9602 and a connected vacuum module.

As shown in FIG. 96, a vacuum extension tunnel 9602 provides linearextension in a semiconductor processing system, facilitating the use ofvarying size process chambers. As an example in FIG. 96, a processchamber 2002L, which is substantially larger than process chamber 2002R,would interfere with an equipment front end module 34002 if it wereconnected without using vacuum extension tunnel 9602. An additionalbenefit of this use of vacuum extension tunnel 9602 is that largeprocess chambers may be used without increasing the size of anassociated robot vacuum chamber 4012 that provides wafer transportbetween adjoining pieces of equipment.

A vacuum tunnel extension 9602 can also be used with load locks 14010 tocreate service access between vacuum modules. Two such examplesillustrated in FIG. 96 include a service access between an upper andlower pair of process chambers, and one between the upper pair ofprocess chambers and an equipment front end module 34002. Service accessrequires a user to closely approach the process equipment and perhaps togain direct access to work piece handling equipment. Without vacuumtunnel extension 9602, a user could not easily approach closely enoughfor servicing.

A vacuum tunnel extension 9602 may be employed in a variety of otherlocations within a system. For example, a vacuum tunnel extension 9602may be employed to connect a linear processing system, a cluster tool, ashared metrology system or an equipment front end module to a cart andtunnel transport system. A vacuum tunnel extension 9602 may facilitateforming various layout shapes of semiconductor processing systems, andmay be provided in various extension lengths.

More generally any of the above systems may be used in combination. Forexample, a linear processing system including work piece transport, suchas that provided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with a bypass thermal adjuster. Awork piece handling vacuum module may facilitate transfer of a workpiece to/from the bypass thermal adjuster. A linear processing systemincluding work piece transport, such as that provided by a work piecehandling vacuum module combined with a transport cart 6140 may beassociated with a wafer center finding method or system. A work piecehandling vacuum module may facilitate collecting data of a work piecebeing handled by the work piece handling vacuum module to support thewafer center finding methods and systems. A work piece handling vacuummodule may include a plurality of work piece sensors to support wafercenter finding. Wafer center finding may also be performed while thework piece is being transported by the transport cart 6140. In oneembodiment, a work piece handling vacuum module, adapted to facilitatewafer center finding, may be assembled to a transport cart 6140 so thata wafer/work piece held within the work piece handling vacuum module maybe subjected to a wafer finding process during transport.

A linear processing system including work piece transport, such as thatprovided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with a process chamber. A workpiece handling vacuum module may facilitate transfer of a work pieceto/from the process chamber. As herein described, processing chambers ofvarious types, sizes, functionality, performance, type, and the like maybe combined with one or more transport carts 6140 to facilitateprocessing flexibility of a semiconductor processing system. A linearprocessing system including work piece transport, such as that providedby a work piece handling vacuum module combined with a transport cart6140 may be associated with a load lock 10410 as herein described. In anexample a work piece handling vacuum module may facilitate transfer of awork piece between the load lock and a transport cart 6140. A linearprocessing system including work piece transport, such as that providedby a work piece handling vacuum module combined with a transport cart6140 may be associated with a work piece storage and handling cassette.A work piece handling vacuum module may facilitate transfer of a workpiece to/from the cassette as shown in FIGS. 68 and 69. A work piecehandling vacuum module may transfer a work piece such as a productionwafer, a test wafer, a calibration wafer, a cleaning wafer, aninstrumented wafer, a wafer centering fixture, and the like to/from thework piece storage.

A linear processing system including work piece transport, such as thatprovided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with an equipment front end module6110. A work piece handling vacuum module may facilitate transfer of awork piece to/from the equipment front end module 6110. The work piecehandling vacuum module may transfer one or more work pieces between twoequipment front end modules 6110 wherein one module is an input module,and one module is an output module, or wherein one of the modules is amid entry input/output module. A transport cart 6140 may be associatedwith an equipment front end module 6110 through a work piece handlingvacuum module as shown in FIG. 78. The work piece handling vacuum modulein FIG. 78 may transfer a work piece between the equipment front endmodule 6110 and one of a process chamber 2002, another work piecehandling vacuum module, or a transport cart 6140. As can be seen in FIG.78, combining work piece handling vacuum modules and equipment front endmodules 6110 with transport carts 6140 within vacuum tunnels 6150 canfacilitate configuring arbitrarily complex or highly flexible processingsystems.

A linear processing system including work piece transport, such as thatprovided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with a work piece elevator. A workpiece handling vacuum module may facilitate transfer of a work pieceto/from the work piece elevator for transporting one or more work piecesbetween vertically separated work piece handling and/or processingsystems. Vertically separated vacuum processing systems may include aprocessing level and a work piece return level that is verticallyseparated. The work piece return level may include a work piecetransport cart or vehicle in a vacuum tunnel for transporting one ormore work pieces to a different location in the vacuum processingsystem. FIGS. 88-91 depict exemplary configurations of linear processingsystems including work piece handling vacuum modules, transport carts6140, and work piece elevators, also known as lifters 8810.

A linear processing system including work piece transport, such as thatprovided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with a cluster system as shown inFIGS. 70 and 86. A work piece handling vacuum module may facilitatetransfer of a work piece to/from the cluster system. A work piecehandling vacuum module may facilitate transfer of a work piece between alinear processing system including a transport cart 6140, and a clusterprocessing cell. The work piece handling vacuum module may transfer thework piece to/from an aspect of the cluster system such as a work piecehandling robot, a load lock, a buffer, and the like. The work piecehandling vacuum module may transfer a work piece through a vacuumextension tunnel 9602 to/from the aspect of the cluster processingsystem.

The work piece handling vacuum module may be modularly connected to thecluster system so that the work piece handling vacuum module may providehandling of work pieces while the cluster processing system may provideprocessing of semiconductor work pieces. The work piece handling vacuummodule may be connected to the cluster system through a buffer module,such as a multifunction module, a passive single work piece buffer, apassive multi work piece buffer, a thermal bypass adapter, a bufferingaligner 9700, and the like. The buffer module may provide a temporarystorage facility for work pieces being transferred between the workpiece handling vacuum module and the cluster system. A robot controllerof the cluster system may access or deposit a work piece in the buffermodule for the work piece handling vacuum module to transfer. Aplurality of cluster systems may be connected to one work piece handlingvacuum module so that the work piece handling vacuum module facilitatestransfer from one cluster system to another. Such a configuration mayinclude a load lock 1401 and/or equipment front end module 6110 forexchange of the work pieces with an operator. The work piece handlingvacuum module may further include facilities for determining a center ofa work piece being handled by the work piece handling vacuum module sothat the work piece can be transferred to the cluster system centeredaccurately to a center reference of the cluster system.

A linear processing system including work piece transport, such as thatprovided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with other work piece handlingvacuum modules. A work piece handling vacuum module may facilitatetransfer of a work piece to/from the other work piece handling vacuummodule.

A linear processing system including work piece transport, such as thatprovided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with a buffer. A work piecehandling vacuum module may facilitate transfer of a work piece to/fromthe buffer. The buffer may facilitate holding work pieces queued to beprocessed. The buffer may further facilitate reducing bottlenecksassociated with robotic work piece handlers, differences in processingtime, delays associated with vacuum environment changes, and the like.

A linear processing system including work piece transport, such as thatprovided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with a controller. The controllermay direct the work piece handling vacuum module to facilitate transferof a work piece from a first section of a semiconductor processingsystem to a second section of the system. Transfer from the first tosecond section of the system may be accomplished by using a transportcart 6140. A section may include one or more of a buffer, a bufferingaligner 9700, another work piece handling vacuum module, a clustersystem, a work piece storage, a work piece elevator, an equipment frontend module, a load lock, a process chamber, a vacuum tunnel extension, amodule including a low particle vent, a module including a pedestal, amodule including a modular utility supply facility, a bypass thermaladjuster, a multifunction module, a robot (e.g. single arm, dual mm,dual end effector, frog leg, and the like), variously shaped processsystems, and the like.

Referring to FIGS. 97-100, work pieces may be temporarily stored inbuffer modules. A buffer module may, for example, be placed between twotransfer robot modules to facilitate handling and throughput, or betweena tunnel 6150 and a robot for similar reasons. The buffer module may beaccessible from multiple of sides and/or by multiple robots. The buffermodule may have the capability to hold a plurality of semiconductor workpieces. In embodiments, the buffer may also be capable of performingalignment of the semiconductor work pieces that are placed into thebuffer. Such a buffer may be referred to as a buffer aligner module9700, an example of which is depicted in FIG. 97. The buffer alignermodule 9700 may include a buffer workpiece holder 9702, an alignerplatform 9704, and an aligner vision system 9708. The buffer work pieceholder 9702 may hold multiple semiconductor work pieces 9710, 9712,9714, and 9718 at one time, which may be vertically stacked or otherwisearranged within the holder 9702. In embodiments, the aligner platform9704 may be capable of holding a single semiconductor work piece androtating or translating the work piece to a desired alignment positionas determined by an aligner controller. The controller may initiate arotation or translation once the semiconductor work piece has beenplaced on the aligner platform 9704, and determine a stopping positionbased on signals provided by the aligner vision system 9708.

The aligner vision system 9708 may sense a notch or other marking on thesemiconductor work piece, and the controller may use the notch todetermine a correct alignment of the work piece, such as by stoppingrotation of the work piece when the notch is in a particular location.The aligner vision system 9708 may also employ optical characterrecognition (OCR) capabilities or other image processing techniques toread and record information presented on the semiconductor work piece,which may include alignment marks as well as textual informationrelating to the work piece. The controller may also, or instead, provideclose-loop sense and control for the alignment of semiconductor workpiece placed on the buffer aligner module 9700.

FIG. 98A shows a transfer robot 9802 transferring a semiconductor workpiece 9720 onto the aligner platform 9704 of the buffer aligner module9700 utilizing a single work piece end-effector. FIG. 98B shows thealigner platform 9704 rotating a semiconductor work piece to be aligned9720. While the aligner platform 9704 is rotating, the aligner visionsystem 9708 may sense the position of the work piece 9720 through somephysical indicator, such as a notch, a marking, or the like. Thecontroller may stop rotation in response to an appropriate signal fromthe aligner vision system 9708 indicating that the work piece isproperly aligned. When aligned, the semiconductor work piece 9720 may betransferred into the buffer work piece holder 9702 as shown in FIG. 98C.

FIG. 99A shows a transfer robot 9802 transferring a second semiconductorwork piece 9720 onto the aligner platform 9704. Note that the firstbuffered work piece 9710 has been previously stored in the top slot ofthe buffer work piece holder. FIG. 99B shows the second semiconductorwork piece 9720 being aligned. FIG. 99C shows the two alignedsemiconductor work pieces stored as a first 9710 and second bufferedwork piece 9712. Finally, FIG. 100A shows all aligned and stored workpieces 9710, 9712, 9714, and 9718, being transferred from the bufferaligner module 9700 by a transfer robot 9802 utilizing a batchend-effector 10002 to simultaneously move the work pieces 9710, 9712,9714, and 9718. FIG. 100B shows the transfer robot 9802 moving the batchof semiconductor work pieces 9710, 9712, 9714, and 9718 to theirdestination with the batch end-effector 10002.

A linear processing system including work piece transport, such as thatprovided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with a buffering aligner 9700. Awork piece handling vacuum module may facilitate transfer of a workpiece to/from the buffering aligner 9700 such as to/from an equipmentfront end module, load lock, and other semiconductor fabrication systemmodules, handlers, and processors. A buffering aligner 9700 may bebeneficially combined with other elements of a linear processing systemto improve throughput. In an example, a buffering aligner 9700 may becombined with a transport cart 6140 system that provides transport of aplurality of aligned wafers in a vacuum environment. A buffering alignercan be employed when a process chamber requires delivery of multiplewafers at the same time, in which case buffering at the alignment cansignificantly increase the system throughput by allowing the system toalign wafers in the background during processing and effecting a batchtransfer to the process module or load lock.

FIG. 101 shows a number of modular linkable handling modules 6130. Eachlinkable module 6130 may be supported by a pedestal 10110. The pedestal10110 may form a unitary support structure for a vacuum robotic handlerand any associated hardware, including, for example, the linking modulesdescribed above. The pedestal 10110 may be generally cylindrical in formwith adequate external diameter to physically support robotics and otherhardware, and adequate internal diameter to permit passage of roboticdrives, electricity, and other utilities.

A robot drive mechanism 10120 may be integrated within the pedestal10110. Integration of the robot drive mechanism 10120 into the supportstructure may advantageously eliminate the need for separate conduits orencasements to house the robot drive mechanism 10120. An access port10125 within the pedestal 10110 may provide user access to variouscomponents of the robot drive 10120 such as motors, amplifiers, sealsetc., so that these components can be removed as individual units forservicing and the like.

The pedestal configuration depicted in FIG. 101 provides additionaladvantages. By raising the modular linkable handling modules 6130substantially above floor level while preserving significant unusedspace between the floor and the modules 6130, the pedestal 10110 offersphysical pathways for process chamber utilities such as water, gas,compressed air, and electricity, which may be routed below the modularlinkable handling modules 6130 and alongside the pedestals 10110. Thus,even without planning for utility access, a simple arrangement ofpedestal-based modules in close proximity ensures adequate access forwires, tubes, pipes, and other utility carriers. In order to achievethis result, the pedestal 10110 preferably has top projection surfacearea (i.e., a shape when viewed from the top) that is completely withinthe top projection surface area of the module 6130 supported above. Thusspace is afforded all the way around the pedestal.

The pedestal 10110 may include a rolling base 10130 (with adjustablestand-offs for relatively permanent installation) on which additionalcontrols, or equipment 10140 may be included. The rolling base 10130further facilitates integration of vacuum modules 6130 into a modularvacuum processing and handling system.

A linear processing system including work piece transport, such as thatprovided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with a pedestal. A work piecehandling vacuum module may be modularly mounted to the pedestal so thatthe pedestal may provide at least support for the work piece handlingvacuum module. The pedestal may further support drive mechanism thatprovide rotation and other motion of a robotic work piece handler in thework piece handling vacuum module. The pedestal may be integrated withthe work piece handling vacuum module as herein described. The pedestalmay further facilitate supporting a work piece handling vacuum module ina position that facilitates transferring a work piece to a transportcart 6140 in a tunnel 6150.

Linking modules 10149 between the vacuum modules 6130 may provide any ofthe functions or tools described herein with reference to, for example,the configurable vacuum modules 9502 described above. This includesauxiliary equipment 10150 such as a vacuum pump, machine visioninspection tool, heating element, or the like, as well as variousmachine utilities (gas, electric, water, etc.) which may be removablyand replaceably affixed in a vacuum or other functional seal to anopening 10155 in the linking module 10149.

FIG. 102 shows how unused space (created by a pedestal supportstructure) around a link module may be coherently allocated amongvarious utilities that might be required to support a semiconductormanufacturing process. Referring to FIG. 102, a portion of a modularvacuum processing system is shown in an exploded view. The portion ofthe system shown in FIG. 102 includes a work piece handling andprocessing system 10200 which may include one or more linkable vacuummodules 6130. The linkable modules 6130 may be interconnected to eachother or to another module such as an inspection module 4010, a vacuumextension, or any other vacuum component. As depicted, each linkablemodule 6130 is mounted on a pedestal 10130 which is in turn mounted onbase 10230.

Processing tools can connect to the work piece handling system 10200 atanyone of the ports of one of the linkable modules 6130. By applyingindustry standards for utility hookup type and position in a processchamber, the position of the utility hookups outside the volume of thelinking modules may be substantially predetermined based on the positionof the linkable module(s) 6130. Due to the pedestal configuration,however, it is also possible to allocate the void space around eachpedestal to ensure a buffer zone 10240, 10250, 10260 around the linkingmodules that affords substantially arbitrary routing of utilitiesthroughout an installation using the linkable modules. The handlingsystem 10200 enables a user to take advantage of modular utilitydelivery components 10240, 10250, and 10260 when preparing to installprocess chambers.

The buffer zones 10240, 10250, and 10260 facilitate delivery ofutilities such as gas, water, and electricity to any process chambersconnected to the linkable modules 6130. These buffer zones 10240, 10250,and 10260 may specifically accommodate positioning requirements ofindustry standards, and may also accommodate any industry standardrequirements for capacity, interfacing, cleanliness, delivery pressure,and the like (without, of course, requiring conformity to thesestandards within the buffer zones).

Conceptually, the buffer zones 10240, 10250, and 10260 may have astructural frame which supports a plurality of conduits 10270 adequatefor delivery of the corresponding utilities. Each conduit 10270 may beconstructed with appropriate materials selected to meet the specificrequirements for delivery of a specific utility, and may be arrangedwithin the buffer zones in any preferred pattern. Additionally, eachconduit device port hookup 10280, may be arrayed in a predeterminedpattern (e.g. meeting industry standards for utility hookup position) tofacilitate connections outside the buffer zones while ensuring alignmentof utility conduits from module to module within the buffer zones.

Device port hookups 10280 may be selected for each utility type. Forexample, a hookup for water may provide reliable interconnect that canwithstand water pressure, temperature, and flow rate requirements, whilea hookup for electricity may provide a reliable interconnect or conduitthat meets electrical impedance, safety, and current capacityrequirements. In embodiments, the position of the device port hookups10280 within the buffer zones may be mechanically identified and/oradjustable (e.g. by means of a flexible conduit).

In an embodiments, a physical device such as a foam mold or otherstructural frame containing hookups 10280 and conduits for variousutilities in each buffer zone 10240, 10250, and 10260 may be provided asa kit, which may allow for a variety of configurations to meetinstallation needs such as height, width, position of conduit, positionof device hookups, and frame mounting within the constraints of thecorresponding standard(s).

In embodiments, the buffer zones 10240, 10250, 10260 may be fullycustomized to meet a specific user installation and operational needs.In such an embodiment the user may provide specifications coveringaspects of the system such as height, width, position of conduit,position of device hookups, mounting method, and optional aspects suchas enclosure, and base to a manufacturer.

In embodiments, the buffer zones 10240, 10250, and 10260 may be arrangedwith one or more of the conduits 10270 in predetermined patterns formingone or more standard layers for utilities, and one or more customizablelayers. The standard layers for example, may be for water andelectricity, while the customizable layers may be for gas. The standardlayers may additionally incorporate predetermined conduits for waterelectrical wiring.

As shown in FIG. 103, the overall size of the buffer zones 10240, 10250,and 10260 may be predetermined to facilitate integration with processchambers 2002 and the handling system 10200. As described above, and asdepicted in FIG. 103, the buffer zones may have a volume defined in atleast one dimension by the volume of the associated linkable module6130.

In embodiments with differently shaped process chambers, such as achamber that is wider in the isolation valve connection area than in theutility components connection area, the width of the buffer zones 10240and 10260 may be different than the embodiment shown in FIG. 103.Alternatively, the device port hookups 10280 may be expandable in lengthto accommodate differently shaped process chambers.

The embodiment shown in FIG. 103 allows buffer zones 10240, 10250, and10260 to be installed under a linkable module and, for example theinspection module 4010, thereby reducing the foot print of the combinedhandling system 10200 while ensuring routing capability for utilities.

FIG. 104 shows a number of linkable modules using utility conduitsadapted to the buffer zones described above. As depicted, utilitydelivery components 10404, 10406, 10408 are attached to the base 1023 dof each linkable module. Each one of the utility deliver components mayinclude conduits, interconnects, and connection ports conforming to anyappropriate standards as generally described above.

In embodiments, the utility delivery components 10404, 10406, 10408 mayinclude sensors for sensing aspects of each utility (e.g., fluid flow,gas flow, temperature, pressure, etc.) and may include a means ofdisplaying the sensed aspects or transmitting sensor data to acontroller or other data acquisition system. Sensors and associateddisplays may be useful for installation, setup, troubleshooting,monitoring, and so forth. For example, a modular utility deliverycomponent 10404 delivering water may include a water pressure sensor, awater flow rate sensor, and/or a water temperature sensor, while adisplay may display the corresponding physical data. Other sensors fordisplay or monitoring may include gas pressure, type, flow rate,electricity voltage, and current. Additionally, the sensors may transmitan externally detectable signal which may be monitored by a utilitycontrol computer system.

A linear processing system including work piece transport, such as thatprovided by a work piece handling vacuum module combined with atransport cart 6140 may be associated with a modular utility deliverycomponent 10240 that may supply utilities such as air, water, gas, andelectricity to a sections of a semiconductor processing system throughmodular connection. Groups of vacuum modules that are being providedutilities though the modular utility delivery component, such as processchambers 2002, multifunction modules 9702, bypass thermal adjusters9402, work piece handling vacuum modules, one or more load locks 14010,wafer storage, and the like may be combined with a transport cart 6140to facilitate transport of one or more work pieces between distalgroups. Referring to FIG. 67, linear processing groups 6610 may belocally configured with modular utility delivery components 10240,10250, 10260, while transport cart 6140 provides work piece transportfrom one group 6610 to another.

FIG. 105 shows a low particle vent system. The system 10500 transferswork pieces to and from a vacuum processing environment, and may includework pieces 10510 loaded and ready to be processed in a semiconductorprocessing facility once a proper vacuum environment is created withinthe system 10500. The system 10500 further includes an adapted gas line10520 connected to a gas line valve 10530, a particle filter 10540, anda shockwave baffle 10550.

In general operation, the system 10500 seals in work pieces with a door10501 that may be opened and closed using any of a variety of techniquesknown to one or ordinary skill in the art to isolate the interior 10502from an exterior environment. In operation, the system opens and closesthe door 10501 to the chamber 10502, opens the gas valve 10530 to supplygas to an interior 10502 of the system 10500, closes the gas valve10530, and then evacuates the interior 10502 to form a vacuum for thework pieces 10510. Unloading the work pieces 10510 may be accomplishedin a similar way except that the system 10500 begins with a vacuumenvironment and is pressurized by the gas flowing through the open gasline valve 10530 and the adapted gas line 10520.

Once the work pieces 10510 are placed in the interior 10502, venting andpumping may be performed. During this process, the particle filter10540, configured in-line with the adapted gas line 10520 or across theopening of the chamber interior 10502, filters large particles beingtransported by the gas. In addition, the baffle 10550 and the adaptedgas line 10520 combine to absorb the supersonic shock waves that resultfrom releasing a vacuum seal for the interior 10502, thereby preventingor mitigating disruption of particles within the interior 10502.

The gas line, typically a cylindrical shaped tube for passing gas fromthe valve 10530 to the module, is adapted by modifying its shape tofacilitate absorbing the supersonic shock wave. In one embodiment, theadapted gas line 10520 may be shaped similar to a firearm silencer, inthat it may have inner wall surfaces that are angled relative to thenormal line of travel of the gas. More generally, the gas line mayinclude any irregular interior surfaces, preferably normal to a centeraxis of the gas line. Such surfaces disperse, cancel, and or absorb theenergy of the supersonic shock wave (e.g., from releasing a vacuumseal).

To further reduce the impact of the supersonic shock wave, the baffle10550 obstructs travel of any remaining shock wave and protects the workpieces 10510 from perturbations that might otherwise carry particlecontamination. The baffle 10550 may be positioned to reflect incidentportions of the supersonic shock wave, canceling some of its energy,resulting in a substantially reduced shock wave impacting surfacesthroughout the interior which may have particles. The baffle 10550 maybe larger than the opening, as large as the opening, or smaller than theopening, and may be generally displaced toward the interior of thechamber from the opening. In one embodiment, the baffle 10550 may bemoveable, so that it may be selectively positioned to obstructshockwaves or admit passage of work pieces.

A low particle vent system as described above may be deployed at anylocation within any of the above systems where a vacuum seal might bereleased or created.

Many of the above systems such as the multi-function modules, batchstorage, and batch end effectors may be employed in combination with thehighly modular systems described herein to preserve floor space anddecrease processing time, particularly for processes that are complex,or for installations that are intended to accommodate several differentprocesses within a single vacuum environment. A number of batchprocessing concepts, and in particular uses of a batch aligner, are nowdescribed in greater detail.

FIG. 106 shows a system 10600 including a number of batch processingmodules 10602 that can process a number of wafers at one time. Eachmodule 10602 may, for example, process 2, 3, 4, or more waferssimultaneously. The system 10600 may also include a batch load lock10604, an in vacuum batch buffer 10606, a buffering aligner 10608, oneor more vacuum robot arms 10610, an atmospheric robot arm 10612 and oneor more front opening unified pods 10614. Each of the foregoingcomponents may be adapted for batch processing of wafers.

The front opening unified pods 10614 may store wafers in groups, such asfour. While a four wafer system is provided for purposes ofillustration, it will be understood that the system 10600 may also, orinstead, be configured to accommodate groups of 2, 3, 4, 5, 6, or morewafers, or combinations of these, and all such groupings may beconsidered batches as that term is used herein.

An in-atmosphere robot 10612 may operate to retrieve groups of wafersfrom the FOUPs 10614 which generally manage atmospheric handling ofwafers for processing in the system 10600. The robot 10612 may travel ona track, cart or other mechanism to access the FOUP's 10614, the loadlock 10604, and the buffering aligner 10608. The robot may include abatch end effector for simultaneously handling a batch of wafers (orother workpieces. The robot 10612 may also, or instead, include dualarms or the like so that a first arm can pick and place between theFOUPs 10614 and the batch aligner 10608 while the other arm provides abatch end effector for batch transfers of the aligned wafers in thebuffer 10608 to the batch load lock 10604 and from the load lock 10604back to the FOUPs 10614.

The buffering aligner 10608 may accommodate a corresponding number ofwafers (e.g., four) that are physically aligned during the bufferingprocess. It will be understood that while a single buffering aligner isshown, a number of buffering aligners may be arranged around thein-atmosphere robot, or may be vertically stacked, in order toaccommodate groups of batches for processing. It will also be understoodthat the buffering aligner 10608 may employ any active or passivetechniques, or combinations of these, known to one of skill in the artto concurrently align two or more wafers for subsequent batch handling.

As a significant advantage, an aligned batch of wafers can be processedmore quickly in batch form downstream. Thus, for example, an alignedbatch of wafers can be transferred to the batch load lock 10604 by therobot 10612 in a manner that preserves alignment for transfer to the invacuum robot 10610, which may include a dual arm and/or dual endeffectors for batch handling of wafers within the vacuum. Further, thein-vacuum batch buffer 10606 may accommodate batches of wafers using,e.g., shelves or the like to preserve alignment during in vacuumbuffering and/or hand off between robots. The batch buffer 10606 may, ofcourse, provide cooling, temperature control storage, or any of theother functions described above that might be useful between processingmodules in a semiconductor manufacturing process.

FIGS. 107A and 107B show a robotic arm useful with the batch processingsystem of FIG. 106. FIG. 107A shows a cross sectional view of the robot10700 while FIG. 107B shows a perspective drawing. In general, a robot10700 may include a first robotic arm 10702 having a single end effector10704 and a second robotic arm 10706 having a dual or other batch endeffector 10708.

Using this robotic arm configuration, the single end effector 10704 maybe employed for individual picks and placements of wafers within moduleswhile the dual end effector 10708 may be employed for batch transfersbetween processing modules via, e.g., batch buffers 10606,robot-to-robot hand offs, or any other suitable batch processingtechnique.

It will be appreciated that numerous variations to this batch techniqueare possible. For example, the batch end effector may include twoblades, three blades, or any other number of blades (or other suitablewafer supports) suitable for use in a batch process. At the same time,each robotic arm 10702, 10706 may be a multi-link SCARA arm, frog legarm, or any other type of robot described herein. In addition, dependingon particular deployments of manufacturing processes, the two arms maybe fully independent, or partially or selectively dependent. All suchvariations are intended to fall within the scope of this disclosure. Inaddition to variations in batch size and robotic arm configurations, itwill be understood that any number of batch processing modules may beemployed. In addition, it may be efficient or useful under certaincircumstances to have one or more non-batch or single wafer processmodules incorporated into a system where process times are suitablyproportional to provide acceptable utilization of the single and batchprocess modules in cooperation.

FIGS. 108A-108C illustrate how multiple transfer planes may be usefullyemployed to conserve floor space in a batch processing system. FIG. 108Ashows a linking module including multiple transfer planes to accommodatesingle or multiple access to wafers within the linking module. Slotvalves or the like are provided to isolate the linking module. FIG. 108Bshows an alternative configuration in which multiple shelves arepositioned between robots without isolation. In this configuration, theshelves may, for example, be positioned above the robots to permit afull range of robotic motion that might otherwise cause a collisionbetween a robotic arm and wafers on the shelves. This configurationnonetheless provides batch processing and or multiple wafer bufferingbetween robots. FIG. 108C shows a top view of the embodiment of FIG.108B. As visible in FIG. 108C, the small adapter with shelves betweenrobots in FIG. 108B permits relatively close positioning of two robotswithout requiring direct robot-to-robot handoffs. Instead each wafer orgroup of wafers can be transferred to the elevated shelves forsubsequent retrieval by an adjacent robot. As a significant advantage,this layout reduces the footprint of two adjacent robots while reducingor eliminating the extra complexity of coordinating directrobot-to-robot handoffs.

Referring now to FIG. 109 a portion of a linear processing tool 10900for processing any suitably sized wafer is shown in accordance with anaspect of an embodiment. The linear processing tool 10900 may includeany suitable processing modules or cells 10901A, 10901B, 10902A, 10902B,10903A, 10903B, 10904A, 10904B arrayed on different levels (e.g. theprocessing modules may be disposed, such as in vertical stacks) oneabove the other in a modular or cellular manner similar to process cells8012 described above) where processing modules 10901A-10904A aredisposed on one wafer processing level 10909A and processing modules10901B-10904 B are disposed on another of the wafer processing levels10909B. While FIG. 109 illustrates two stacked wafer processing levels10909A, 10909B formed by the vertically stacked processing modules10901A-10904A, 10901B-10904B it should be understood that in otheraspects of the embodiment shown in FIG. 109 the wafer processing tool10900 may have any number of vertically stacked wafer processing levels.It is noted that while the process modules are shown in the Figs. asbeing in substantially linear stacks, in other aspects the processingmodules on the different processing levels may be offset linearly (e.g.horizontally staggered) from each other if desired. The processingmodules on the respective processing levels 10901A-10904A, 10901B-10904Bmay be communicably coupled to a respective transport tunnel 10910,10911. The vertically stacked transport tunnels/chambers 10910, 10911may be generally similar to the transport tunnels/chambers describedabove with respect to transfer chambers formed by the modular vacuumchambers 4012 (e.g. to form a linear or linearly elongated transportchamber) and may include buffer stations 4010 interposed between one ormore modules 4012 transfer tunnels/chambers. It is noted that thetransport tunnels 10910, 10911 are configured to hold a sealedenvironment therein such as a vacuum or other controlled environment. Itis noted that while the transport chambers/tunnels 10910, 10911 formedby the transport chamber modules 4012 are shown as being similar in theFigs. in other aspects the transport chamber/tunnel 10910, 10911 of onelevel may be different than the transport chamber/tunnel 10910, 10911 ofanother level.

As may be realized the processing tool 10900 is a modular tool that canbe “built up” depending on a desired processing capacity. For example,the processing tool may be initially provided in an initial modularconfiguration with one or more levels. Then selected modules may bejoined at one level, or more than one level building linearly along thelevel or otherwise in a vertical array from the configurations shown in,e.g., FIGS. 110A-110D. For exemplary purposes only the processing toolmay be built as a single level 10909A processing system including, forexample, transport tunnel 10910 and processing modules 10901A, 10902A,10903A, 10904A (although in other aspects the processing system may beinitially set up as a multilevel processing system). As, processinglevels/quantities increase the transport tunnel 10910 may be extended(e.g. by adding additional transfer chambers 4012 and/or buffer stations4010 to the transport tunnel) and/or, depending on available floorspace, additional processing levels may be added to increase thethroughput/capacity of the processing tool. For example, transportchamber/tunnel 10911 may be added to the tool along with processingmodules 10901B, 10902B, 10903B, 10904B so that the configuration of theprocessing tool becomes a multilevel 10909A, 10909B processing tool asshown in FIG. 109. It is noted that the modular processing tool 10900 isnot limited to two processing levels and may have more than twoprocessing levels and any desired length transport tunnels.

As described above, each transfer chamber 4012 includes at least onetransfer robot 10920 which may be substantially similar to transferrobot 4002 or any other suitable robot such as those described above andthose described in U.S. Pat. No. 8,008,884 and U.S. patent applicationSer. No. 13/219,267 filed on Aug. 26, 2011 and Ser. No. 12/163,996 filedon Jun. 27, 2008, the disclosures of which are incorporated by referenceherein in their entireties. As may be realized, the at least onetransfer robot 10920 may include a two degree of freedom drive withZ-axis motion. In other aspects the robot may include a drive with moreor less than two degrees of freedom with or without Z-axis motion. Inanother aspect, the at least one transfer robot 109250 may have at leastone joint, such as the shoulder joint of the robot, that is positionallyfixed along a linear path that is formed by a respective transportchamber/tunnel 10910, 10911. As may also be realized, the at least onetransfer robot 10920 in each modular transfer chamber 4012 may bearranged for robot to robot substrate handoffs between transfer robotsin adjacent transport chambers 4012 either directly or indirectly suchas through the buffer stations 4010. As described above each transferchamber 4012 and/or buffer station 4010 may have vertically stackedwafer transfer planes such that each wafer processing level 10909A,10909B has respective vertically stacked wafer transfer planes allowingfor unidirectional or bidirectional transport of wafers along the lengthof a respective transport tunnel 10910, 10911. For example, where eachtunnel has bidirectional wafer travel such as through vertically stackedrobots, e.g. having arms located one over the other, one level oftransport in a first direction along the length of the tunnel may be forproviding wafers to the processing stations while the other level oftransport in the opposite direction may be for providing a substantiallyobstruction free return path for the wafers where the wafers may betransferred to, for example, an EFEM without further processing or anyother suitable wafer holding location. In other aspects the transferchambers of one or more levels (or a portion thereof) may have one wafertransfer plane. In other aspects one of the transport tunnels 10910,10911 may be configured to transport wafers in a first direction along alength of one level of the processing tool while another of thetransport tunnels 10910, 10911 at a different level may serve to providea return transport path for the wafers along a length of the processingtool. As may be realized any suitable controller 10900C may be connectedto the processing tool 10900 for controlling the components of theprocessing tool for effecting the directional travel (e.g. process flow)of the wafers through processing tool 10900. In one aspect, as shown inFIG. 112, at least one of the transport tunnels 10910, 10911 may beconnected to a return system 11220 substantially similar to returnsystems 6150, 14012 described above. For example, a load lock 11210 maybe located at one or more ends of the at least one transport tunnel forconnecting the transport tunnel(s) to the return system 11220. The loadlock 11210 may include a lift system substantially similar to lift 8810described above for transferring the wafers between one or more of theprocessing levels 10909 A, 10909B and a level of the return system11220. While the return system 11220 is shown in FIG. 112 as beingdisposed above the transport tunnels 10910, 10911 in other aspects thereturn system may be disposed below the transport tunnels 10910, 10911in a manner substantially similar to that described above or in betweenthe tunnels (e.g. one tunnel is located above the return and anothertunnel is located below the return). As may be realized access to thereturn system 11220 may also be provided at a point between the ends ofthe transport tunnels 10910, 10911 such as through a loadlock orsealable buffer station 4010X in a manner substantially similar to thatdescribed above with respect to, e.g., FIG. 14.

It is also noted that while each transfer chamber 4012 is shown ashaving a robot 10920 in other aspects each of the transport tunnels mayinclude one or more wafer transport carts substantially similar to thetransport carts described above where the carts may have a robot mountedthereto or be a passive cart (e.g. without a robot mounted thereto, suchthat stationary robots transfer wafer to and from the car for transportthrough the transport tunnels). It is noted that the transport tunnelsmay also include a combination of robots and carts, as shown in FIG.114, in a manner substantially similar to that described above.

The transport tunnels 10910, 10911 may be communicably connected to eachother in any suitable manner for transferring wafers between thedifferent wafer processing levels 10901A, 10909B. For example, thetransport tunnels 10910, 10911 may be communicably connected to eachother through an EFEM (Equipment Front End Module) having a robot withvertical motion capabilities such as robot 8310 (see FIGS. 112, 113)described above where the robot is configured to receive wafers, eitherdirectly or indirectly (such as through a buffer station) from a robot10920 within one of the vertically stacked tunnels 10910, 10911 and movethe wafer vertically for transfer into another one of the verticallystacked tunnels 10910, 10911 in a manner substantially similar to thatdescribed above with respect to, as a non-limiting example, FIGS. 83,84, and 88-91. As may also be realized, one or more of the bufferstations 4010 may be a stacked buffer station 11010 (see FIGS. 110A and111) that communicably connects the stacked transport tunnels 10910,10911 on different levels. The stacked buffer station 11010 may includea wafer holding station 11010S having vertical motion capabilities (e.g.substantially similar to robot 8310) for transporting wafers between thestacked transport tunnels at a location midway or otherwise at alocation between the ends of the tunnels 10910, 10911. In other aspectsthe stacked buffer station may include a robot substantially similar torobot 8310 for transporting wafers between the stacked transport tunnels10910, 10911.

Referring to FIGS. 110A-110D different configurations of linearprocessing tools 11000-11003 are shown. The linear processing tools11000-11003 may be substantially similar to linear processing tool 10900described above. In FIG. 110A the processing tool 11000 is shown havingstacked transport tunnels 10910, 10911 with, for example, six stackedprocessing modules 10903 coupled thereto for providing the processingtool 11000 with, for example, twelve processing modules. In FIG. 110Bthe processing tool 11001 is shown having stacked transport tunnels10910, 10911 with, for example, four stacked processing modules 10903coupled thereto for providing the processing tool 11000 with, forexample, eight processing modules. In FIG. 110C the processing tool11002 is shown having stacked transport tunnels 10910, 10911 with, forexample, two stacked processing modules 10903 coupled thereto forproviding the processing tool 11000 with, for example, four processingmodules. It is noted that while processing tools 11000-11002 are shownhaving processing stations 10903 coupled to two opposite lateral sidesin other aspects the processing stations 10903 may be coupled to but asingle lateral side of the transport tunnels 10910, 10911 as shown inFIG. 110D. The processing tool 11003 in FIG. 110D has, for example,three stacked processing stations coupled to a single or common side ofthe transport tunnels 10910, 10911 providing the processing tool with,for example, six processing modules. It should be understood that whileonly two stacked transport tunnels 10910, 10911 are illustrated in FIGS.109-110D in other aspects the processing tools may include any suitablenumber of stacked transport tunnels for providing accessing toprocessing stations having any suitable number of stacked processingmodules. It should also be realized that an EFEM may be disposed at oneor both ends of the transport tunnels. In other aspects the processingtools may have any suitable configuration employing any suitable numberof wafer processing levels.

Having thus described several illustrative embodiments, it is to beappreciated that various alterations, modifications, and improvementswill readily occur to those skilled in the art. Such alterations,modifications, and improvements are intended to form a part of thisdisclosure, and are intended to be within the spirit and scope of thisdisclosure. While some examples presented herein involve specificcombinations of functions or structural elements, it should beunderstood that those functions and elements may be combined in otherways according to the disclosed embodiment to accomplish the same ordifferent objectives. In particular, acts, elements, and featuresdiscussed in connection with one embodiment are not intended to beexcluded from similar or other roles in other embodiments. Accordingly,the foregoing description and attached drawings are by way of exampleonly, and are not intended to be limiting.

The elements depicted in flow charts and block diagrams throughout thefigures imply logical boundaries between the elements. However,according to software or hardware engineering practices, the depictedelements and the functions thereof may be implemented as parts of amonolithic software structure, as standalone software modules, or asmodules that employ external routines, code, services, and so forth, orany combination of these, and all such implementations are within thescope of the present disclosure. Thus, while the foregoing drawings anddescription set forth functional aspects of the disclosed systems, noparticular arrangement of software for implementing these functionalaspects should be inferred from these descriptions unless explicitlystated or otherwise clear from the context.

Similarly, it will be appreciated that the various steps identified anddescribed above may be varied, and that the order of steps may beadapted to particular applications of the techniques disclosed herein.All such variations and modifications are intended to fall within thescope of this disclosure. As such, the depiction and/or description ofan order for various steps should not be understood to require aparticular order of execution for those steps, unless required by aparticular application, or explicitly stated or otherwise clear from thecontext.

The methods or processes described above, and steps thereof, may berealized in hardware, software, or any combination of these suitable fora particular application. The hardware may include a general-purposecomputer and/or dedicated computing device. The processes may berealized in one or more microprocessors, micro controllers, embeddedmicrocontrollers, programmable digital signal processors or otherprogrammable device, along with internal and/or external memory. Theprocesses may also, or instead, be embodied in an application specificintegrated circuit, a programmable gate array, programmable array logic,or any other device or combination of devices that may be configured toprocess electronic signals. It will further be appreciated that one ormore of the processes may be realized as computer executable codecreated using a structured programming language such as C, an objectoriented programming language such as C++, or any other high-level orlow-level programming language (including assembly languages, hardwaredescription languages, and database programming languages andtechnologies) that may be stored, compiled or interpreted to run on oneof the above devices, as well as heterogeneous combinations ofprocessors, processor architectures, or combinations of differenthardware and software.

Thus, in one aspect, each method described above and combinationsthereof may be embodied in computer executable code that, when executingon one or more computing devices, performs the steps thereof. In anotheraspect, the methods may be embodied in systems that perform the stepsthereof, and may be distributed across devices in a number of ways, orall of the functionality may be integrated into a dedicated, standalonedevice or other hardware. In another aspect, means for performing thesteps associated with the processes described above may include any ofthe hardware and/or software described above. All such permutations andcombinations are intended to fall within the scope of the presentdisclosure.

While the aspects of the disclosed embodiment have been disclosed inconnection with the preferred embodiments shown and described in detail,various modifications and improvements thereon will become readilyapparent to those skilled in the art. Accordingly, the spirit and scopeof the disclosed embodiment is not to be limited by the foregoingexamples, but is to be understood in the broadest sense allowable bylaw.

All documents referenced herein are hereby incorporated by reference.

In accordance with one or more aspects of the disclosed embodiments asubstrate processing system is provided. The substrate processing systemincludes at least two vertically stacked transport tunnels, at least oneprocess cell including vertically stacked process modules where eachprocess module is communicably coupled to a respective one of the atleast two vertically stacked transport tunnels, and at least onestationary transport robot in each of the at least two verticallystacked transport tunnels where the at least one stationary transportrobot is configured to transport substrates along a length of the tunneland into respective ones of the vertically stacked process modules.

In accordance with one or more aspects of the disclosed embodiments theat least one transport robot in each of the at least two verticallystacked transport tunnels comprises a plurality of transport robotsconfigured to pass substrates from transfer robot to transfer robotalong a length of a respective one of the at least two verticallystacked transport tunnels. In a further aspect each of the plurality oftransport robots is disposed in a sealable chamber where each of thesealable chambers are communicably coupled to each other to form therespective one of the at least two vertically stacked transport tunnels.In still a further aspect each of the at least two vertically stackedtransport tunnels includes a buffer station disposed between at leasttwo of the sealable chambers. In yet another aspect the buffer stationincludes a substrate elevator configured to transfer substrates betweeneach of the at least two vertically stacked transport tunnels.

In accordance with one or more aspects of the disclosed embodiments atleast one end of each of the at least two vertically stacked transporttunnels is communicably coupled to a common loading station, wherein thecommon loading station includes a substrate elevator for transferringsubstrates between each of the at least two vertically stacked transporttunnels.

In accordance with one or more aspects of the disclosed embodiments eachof the at least two vertically stacked transport tunnels includes duallevel transport robots that form vertically stacked substrate transferplanes within a respective one of the at least two vertically stackedtransport tunnels. In a further aspect the vertically stacked substratetransfer planes allow for bidirectional substrate travel in each of theat least two vertically stacked transport tunnels. In another aspect oneof the vertically stacked substrate transfer planes is a return laneconfigured for substantially unobstructed transport of substrates.

In accordance with one or more aspects of the disclosed embodiments eachof the at least two vertically stacked transport tunnels includeslateral sides, wherein the at least one process cdl is disposed on but asingle lateral side of the at least two vertically stacked transporttunnels.

In accordance with one or more aspects of the disclosed embodiments eachof the at least two vertically stacked transport tunnels includeslateral sides, wherein the at least one process cell comprises at leasttwo process cells disposed on opposite lateral sides of the at least twovertically stacked transport tunnels.

In accordance with one or more aspects of the disclosed embodiments oneof the at least two vertically stacked transport tunnels providessubstrate transport in a first direction and the other of the at leasttwo vertically stacked transport tunnels provides substrate transport ina substantially opposite direction.

In accordance with one or more aspects of the disclosed embodiments asubstrate processing system includes at least two vertically stackedtransport chambers, each of the vertically stacked transport chambersincluding a plurality of openings arranged to form vertical stacks ofopenings configured for coupling to vertically stacked process modules,at least one of the vertically stacked transport chambers includes atleast one transport chamber module arranged for coupling to anothertransport chamber module to form a linear transport chamber and anotherof the at least two stacked transport chambers including at least onetransport chamber module arranged for coupling to another transportchamber module to form another linear transport chamber, and a transportrobot disposed in each of the transport chamber modules, where a jointof the transport robot is locationally fixed along a linear path formedby the respective linear transport chamber.

In accordance with one or more aspects of the disclosed embodiments thetransport robot includes a two degree of freedom drive with Z axismovement.

In accordance with one or more aspects of the disclosed embodiments eachof the transport chamber modules are sealable chambers.

In accordance with one or more aspects of the disclosed embodiments eachof the linear transport chambers includes a buffer station disposedbetween at least two of the transport chamber modules.

In accordance with one or more aspects of the disclosed embodiments thebuffer station includes a substrate elevator configured to transfersubstrates between each of the linear transport chambers.

In accordance with one or more aspects of the disclosed embodiments atleast one end of each of the at least two vertically stacked transportchambers is communicably coupled to a common loading station, whereinthe common loading station includes a substrate elevator fortransferring substrates between each of the at least two verticallystacked transport chambers.

In accordance with one or more aspects of the disclosed embodimentstransport robots of each of the at least two vertically stackedtransport chambers include dual level transport robots that formvertically stacked substrate transfer planes within a respective one ofthe at least two vertically stacked transport chambers.

In accordance with one or more aspects of the disclosed embodiments thevertically stacked substrate transfer planes allow for bidirectionalsubstrate travel in each of the at least two vertically stackedtransport chambers.

In accordance with one or more aspects of the disclosed embodiments oneof the vertically stacked substrate transfer planes is a return laneconfigured for substantially unobstructed transport of substrates.

In accordance with one or more aspects of the disclosed embodiments eachof the at least two vertically stacked transport chambers includeslateral sides, wherein the plurality of openings are disposed on but asingle lateral side of a respective one of the at least two verticallystacked transport chambers.

In accordance with one or more aspects of the disclosed embodiments eachof the at least two vertically stacked transport chambers includeslateral sides, wherein the plurality of openings are disposed onopposite lateral sides of a respective one of the at least twovertically stacked transport chambers.

In accordance with one or more aspects of the disclosed embodiments oneof the at least two vertically stacked transport chambers providessubstrate transport in a first direction and the other of the at leasttwo vertically stacked transport chambers provides substrate transportin a substantially opposite direction.

In accordance with one or more aspects of the disclosed embodiments thetransport robots of a respective linear transport chamber are arrangedfor robot to robot substrate handoff.

In accordance with one or more aspects of the disclosed embodiments asubstrate processing system includes at least two vertically stackedlinear transport chambers, each of the vertically stacked lineartransport chambers being arranged in a respective processing level andincluding a plurality of chambers communicably coupled to each other toform a respective linear transport chamber that is distinct from otherones of the at least two vertically stacked transport tunnels, eachrespective linear transport chamber having openings arranged forcoupling with a process module, and a transport robot disposed in eachof the plurality of chambers where a joint of the transport robot islocationally fixed along a linear path formed by the respective lineartransport chamber.

In accordance with one or more aspects of the disclosed embodiments thesubstrate processing system is a modular system configured to acceptadditional processing levels stacked with existing processing levels.

In accordance with one or more aspects of the disclosed embodiments eachof the at least two vertically stacked linear transport chambers ismodular such that a length of a respective vertically stacked lineartransport chamber can be extended independent of other ones of the atleast two vertically stacked linear transport chambers.

In accordance with one or more aspects of the disclosed embodiments theopenings of the at least two vertically stacked linear transportchambers are arranged to form vertical stacks of openings for couplingwith vertically stacked process modules.

In accordance with one or more aspects of the disclosed embodiments asubstrate processing system includes at least two vertically stackedtransport chambers, each having a plurality of openings, the pluralityof openings of the at least two vertically stacked transport chamberbeing arranged to form vertical stacks of openings for coupling withprocess cells that include vertically stacked process modules, and atleast one transport robot in each of the at least two vertically stackedtransport chambers where the at least one transport robot is configuredto transport substrates along a length of the tunnel and into respectiveones of the vertically stacked process modules, the at least onetransport robot having a joint that is locationally fixed along a linearpath formed by a respective one of the vertically stacked transportchambers.

In accordance with one or more aspects of the disclosed embodiments eachof the at least two vertically stacked transport chambers includes atleast one chamber configured for coupling with another chamber to form alinear transport chamber.

In accordance with one or more aspects of the disclosed embodiments eachof the at least one chamber includes a positionally fixed transportrobot.

1. A substrate processing system comprising: at least two verticallystacked transport chambers, each of the vertically stacked transportchambers being separate and distinct from another of the at least twovertically stacked transport chambers and including a plurality ofopenings arranged to form vertical stacks of openings configured forcoupling to vertically stacked process modules, at least one of thevertically stacked transport chambers includes at least one transportchamber module arranged for coupling to another transport chamber moduleto form a linear transport chamber and another of the at least twostacked transport chambers including at least one transport chambermodule arranged for coupling to another transport chamber module to formanother linear transport chamber separate and distinct from the lineartransport chamber; and a transport robot disposed in each of thetransport chamber modules, where a joint of the transport robot islocationally fixed along a linear path formed by the respective lineartransport chamber.
 2. The substrate processing system of claim 1,wherein the transport robot includes a two degree of freedom drive withZ axis movement.
 3. The substrate processing system of claim 1, whereineach of the transport chamber modules are sealable chambers.
 4. Thesubstrate processing system of claim 1, wherein each of the lineartransport chambers includes a buffer station disposed between at leasttwo of the transport chamber modules.
 5. The substrate processing systemof claim 4, wherein the buffer station includes a substrate elevatorconfigured to transfer substrates between each of the linear transportchambers.
 6. The substrate processing system of claim 1, wherein atleast one end of each of the at least two vertically stacked transportchambers is communicably coupled to a common loading station, whereinthe common loading station includes a substrate elevator fortransferring substrates between each of the at least two verticallystacked transport chambers.
 7. The substrate processing system of claim1, wherein transport robots of each of the at least two verticallystacked transport chambers include dual level transport robots that formvertically stacked substrate transfer planes within a respective one ofthe at least two vertically stacked transport chambers.
 8. The substrateprocessing system of claim 7, wherein the vertically stacked substratetransfer planes allow for bidirectional substrate travel in each of theat least two vertically stacked transport chambers.
 9. The substrateprocessing system of claim 7, wherein one of the vertically stackedsubstrate transfer planes is a return lane configured for substantiallyunobstructed transport of substrates.
 10. The substrate processingsystem of claim 1, wherein each of the at least two vertically stackedtransport chambers includes lateral sides, wherein the plurality ofopenings are disposed on but a single lateral side of a respective oneof the at least two vertically stacked transport chambers.
 11. Thesubstrate processing system of claim 1, wherein each of the at least twovertically stacked transport chambers includes lateral sides, whereinthe plurality of openings are disposed on opposite lateral sides of arespective one of the at least two vertically stacked transportchambers.
 12. The substrate processing system of claim 1, wherein one ofthe at least two vertically stacked transport chambers providessubstrate transport in a first direction and the other of the at leasttwo vertically stacked transport chambers provides substrate transportin a substantially opposite direction.
 13. The substrate processingsystem of claim 1, wherein the transport robots of a respective lineartransport chamber are arranged for robot to robot substrate handoff. 14.A substrate processing system comprising: at least two verticallystacked linear transport chambers, each of the vertically stacked lineartransport chambers being separate and distinct from another of the atleast two vertically stacked linear transport chambers and arranged in arespective processing level and including a plurality of chamberscommunicably coupled to each other to form a respective linear transportchamber that is separate and distinct from other ones of the at leasttwo vertically stacked linear transport chambers, each respective lineartransport chamber having openings arranged for coupling with a processmodule; and a transport robot disposed in each of the plurality ofchambers where a joint of the transport robot is locationally fixedalong a linear path formed by the respective linear transport chamber.15. The substrate processing system of claim 14, wherein the substrateprocessing system is a modular system configured to accept additionalprocessing levels stacked with existing processing levels.
 16. Thesubstrate processing system of claim 14, wherein each of the at leasttwo vertically stacked linear transport chambers is modular such that alength of a respective vertically stacked linear transport chamber canbe extended independent of other ones of the at least two verticallystacked linear transport chambers.
 17. The substrate processing systemof claim 14, wherein the openings of the at least two vertically stackedlinear transport chambers are arranged to form vertical stacks ofopenings for coupling with vertically stacked process modules.
 18. Asubstrate processing system comprising: at least two vertically stackedtransport chambers, each vertically stacked transport chamber beingseparate and distinct from another of the at least two verticallystacked transport chambers and having a plurality of openings, theplurality of openings of the at least two vertically stacked transportchambers being arranged to form vertical stacks of openings for couplingwith process cells that include vertically stacked process modules; andat least one transport robot in each of the at least two verticallystacked transport chambers where the at least one transport robot isconfigured to transport substrates along a length of the tunnel and intorespective ones of the vertically stacked process modules, the at leastone transport robot having a joint that is locationally fixed along alinear path formed by a respective one of the vertically stackedtransport chambers.
 19. The substrate processing system of claim 18,wherein each of the at least two vertically stacked transport chambersincludes at least one chamber configured for coupling with anotherchamber to form a linear transport chamber.
 20. The substrate processingsystem of claim 19, wherein each of the at least one chamber includes apositionally fixed transport robot.